Publication

Comparison and combination of reduced order modelling techniques in 3D parametrized heat transfer problems

Related publications (30)

Thermal transport beyond Fourier, and beyond Boltzmann

Crystals and glasses exhibit fundamentally different heat conduction mechanisms: the periodicity of crystals allows for the excitation of propagating vibrational waves that carry heat, as first discussed by Peierls in 1929, while in glasses the lack of per ...

EPFL2021

Flow boiling heat transfer and two-phase flow phenomena of CO2 in macro-and micro-channel evaporators: Fundamentals, applications and engineering design

John Richard Thome

The paper presents a comprehensive review of fundamentals and engineering applications of CO2 flow boiling heat transfer, flow patterns and two-phase pressure drops in macro- and micro-channel evaporators. First, distinctions of macro- and micro-channels a ...

PERGAMON-ELSEVIER SCIENCE LTD2021

Co-designing electronics with microfluidics for more sustainable cooling

Elison de Nazareth Matioli, Reza Soleiman Zadeh Ardebili, Georgios Kampitsis, Remco Franciscus Peter van Erp, Luca Nela

Thermal management is one of the main challenges for the future of electronics1,2,3,4,5. With the ever-increasing rate of data generation and communication, as well as the constant push to reduce the size and costs of industrial converter systems, the powe ...

NATURE RESEARCH2020

System for co2 capture from internal combustion engine

François Maréchal, Shivom Sharma

System (2) for CO2 capture from a combustion engine (1) comprising an exhaust gas flow circuit (6) having an inlet end fluidly connected to an exhaust of the combustion engine, a heat exchanger circuit (12), a primary exhaust gas heat exchanger (H1) for tr ...

2020

Design Of Passive Two-Phase Thermosyphons For Server Cooling

John Richard Thome, Jackson Braz Marcinichen, Raffaele Luca Amalfi, Filippo Cataldo

The main objective of this paper is to utilize an improved version of the simulator presented at InterPACK 2017 to design a thermosyphon system for energy-efficient heat removal from 2-U servers used in high-power datacenters. Currently, between 25% and 45 ...

AMER SOC MECHANICAL ENGINEERS2020

Buoyancy-driven melting and solidification heat transfer analysis in encapsulated phase change materials

Sophia Haussener, Nithin Mallya

Controlled melting and solidification in encapsulated phase change materials (PCMs) is of practical interest, for example, in latent heat storage applications. The choice of PCMs and the dynamic heat transfer characteristics during phase change - affecting ...

2021

Generalization of Fourier’s Law into Viscous Heat Equations

Nicola Marzari, Andrea Cepellotti, Michele Simoncelli

Heat conduction in dielectric crystals originates from the dynamics of atomic vibrations, whose evolution is well described by the linearized Boltzmann transport equation for the phonon populations. Recently, it was shown that thermal conductivity can be r ...

American Physical Society2020

Micro-Two-Phase Electronics Cooling: Finally on Its Way

John Richard Thome

In this paper, I will present an abridged overview of what is presented in my keynote lecture. I will recount some of the initial history of microchannel two-phase flow and boiling work by others that enticed me to join into the development of this field a ...

IEEE2019

Optimum ratio of hydrophobic to hydrophilic areas of biphilic surfaces in thermal fluid systems involving boiling

Luis Guillermo Villanueva Torrijo, Tom Larsen, Ahmad Reza Motezakker

Pool boiling has a high heat removal capability and is considered as one of the most effective cooling methods due to utilization of latent heat of vaporization. Surface wettability plays a key role in boiling heat transfer since it controls the contact li ...

2019

Near-junction heat spreaders for hot spot thermal management of high power density electronic devices

Elison de Nazareth Matioli, Riyaz Mohammed Abdul Khadar, Reza Soleiman Zadeh Ardebili, Remco Franciscus Peter van Erp, Mehdi Naamoun

Many high power (opto-) electronic devices such as transistors, diodes, and lasers suffer from significant hot spot temperature rises due to the high heat fluxes generated in their active area, which limits their performance, reliability, and lifetime. Emp ...

2019