Publication

Selective ion-induced grain growth: Thermal spike modeling and its experimental validation

2013
Journal Articles

Abstract

Ion-bombardment-induced selective grain growth is a process that allows for full control of the orientation of vapor-deposited thin films, which can be converted from fiber-textured polycrystalline to single-crystal films. The main mechanisms behind this phenomenon are explained by a new thermal spike model, which takes into account and compares the different driving forces governing the film microstructure evolution upon irradiation and emphasizes the importance of the thermal spike shape and volume. The strong agreement between model and experimental data confirms that selective grain growth is driven by the minimization of the volume free energy. (C) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Official source

https://infoscience.epfl.ch/entities/publication/f5c00553-03b0-496c-a049-4414351746db

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2013
Journal Articles

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/f5c00553-03b0-496c-a049-4414351746db

About this result

Related concepts (30)

Thin film

A thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. The controlled synthesis of materials as thin films (a process referred to as deposition) is a fundamental step in many applications. A familiar example is the household mirror, which typically has a thin metal coating on the back of a sheet of glass to form a reflective interface. The process of silvering was once commonly used to produce mirrors, while more recently the metal layer is deposited using techniques such as sputtering.

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

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Selective ion-induced grain growth: Thermal spike modeling and its experimental validation

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