Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
Semiconductor fabrication plantIn the microelectronics industry, a semiconductor fabrication plant (commonly called a fab; sometimes foundry) is a factory for semiconductor device fabrication. Fabs require many expensive devices to function. Estimates put the cost of building a new fab over one billion U.S. dollars with values as high as 3–4billionnotbeinguncommon.TSMCinvested9.3 billion in its Fab15 300 mm wafer manufacturing facility in Taiwan. The same company estimations suggest that their future fab might cost $20 billion. Very Large Scale IntegrationVery large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit (Metal Oxide Semiconductor) chips were developed and then widely adopted, enabling complex semiconductor and telecommunication technologies. The microprocessor and memory chips are VLSI devices. Before the introduction of VLSI technology, most ICs had a limited set of functions they could perform.
Carbon-fiber-reinforced polymersCarbon fiber-reinforced polymers (American English), carbon-fiber-reinforced polymers (Commonwealth English), carbon-fiber-reinforced plastics, carbon-fiber reinforced-thermoplastic (CFRP, CRP, CFRTP), also known as carbon fiber, carbon composite, or just carbon, are extremely strong and light fiber-reinforced plastics that contain carbon fibers. CFRPs can be expensive to produce, but are commonly used wherever high strength-to-weight ratio and stiffness (rigidity) are required, such as aerospace, superstructures of ships, automotive, civil engineering, sports equipment, and an increasing number of consumer and technical applications.
ElastomerAn elastomer is a polymer with viscoelasticity (i.e. both viscosity and elasticity) and with weak intermolecular forces, generally low Young's modulus (E) and high failure strain compared with other materials. The term, a portmanteau of elastic polymer, is often used interchangeably with rubber, although the latter is preferred when referring to vulcanisates. Each of the monomers which link to form the polymer is usually a compound of several elements among carbon, hydrogen, oxygen and silicon.
Composite materialA composite material (also called a composition material or shortened to composite, which is the common name) is a material which is produced from two or more constituent materials. These constituent materials have notably dissimilar chemical or physical properties and are merged to create a material with properties unlike the individual elements. Within the finished structure, the individual elements remain separate and distinct, distinguishing composites from mixtures and solid solutions.
Ceramic matrix compositeIn materials science, ceramic matrix composites (CMCs) are a subgroup of composite materials and a subgroup of ceramics. They consist of ceramic fibers embedded in a ceramic matrix. The fibers and the matrix both can consist of any ceramic material, whereby carbon and carbon fibers can also be regarded as a ceramic material. The motivation to develop CMCs was to overcome the problems associated with the conventional technical ceramics like alumina, silicon carbide, aluminum nitride, silicon nitride or zirconia – they fracture easily under mechanical or thermo-mechanical loads because of cracks initiated by small defects or scratches.
Carbon fibersCarbon fibers or carbon fibres (alternatively CF, graphite fiber or graphite fibre) are fibers about in diameter and composed mostly of carbon atoms. Carbon fibers have several advantages: high stiffness, high tensile strength, high strength to weight ratio, high chemical resistance, high-temperature tolerance, and low thermal expansion. These properties have made carbon fiber very popular in aerospace, civil engineering, military, motorsports, and other competition sports.
Thermoplastic elastomerThermoplastic elastomers (TPE), sometimes referred to as thermoplastic rubbers, are a class of copolymers or a physical mix of polymers (usually a plastic and a rubber) that consist of materials with both thermoplastic and elastomeric properties. While most elastomers are thermosets, thermoplastics are in contrast relatively easy to use in manufacturing, for example, by injection moulding. Thermoplastic elastomers show advantages typical of both rubbery materials and plastic materials.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Laser ablationLaser ablation or photoablation (also called laser blasting) is the process of removing material from a solid (or occasionally liquid) surface by irradiating it with a laser beam. At low laser flux, the material is heated by the absorbed laser energy and evaporates or sublimates. At high laser flux, the material is typically converted to a plasma. Usually, laser ablation refers to removing material with a pulsed laser, but it is possible to ablate material with a continuous wave laser beam if the laser intensity is high enough.
Pin grid arrayA pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).
Silicone rubberSilicone rubber is an elastomer (rubber-like material) composed of silicone—itself a polymer—containing silicon together with carbon, hydrogen, and oxygen. Silicone rubbers are widely used in industry, and there are multiple formulations. Silicone rubbers are often one- or two-part polymers, and may contain fillers to improve properties or reduce cost. Silicone rubber is generally non-reactive, stable, and resistant to extreme environments and temperatures from while still maintaining its useful properties.
Carbon nanotubeA carbon nanotube (CNT) is a tube made of carbon with a diameter in the nanometer range (nanoscale). They are one of the allotropes of carbon. Single-walled carbon nanotubes (SWCNTs) have diameters around 0.5–2.0 nanometers, about 100,000 times smaller than the width of a human hair. They can be idealized as cutouts from a two-dimensional graphene sheet rolled up to form a hollow cylinder. Multi-walled carbon nanotubes (MWCNTs) consist of nested single-wall carbon nanotubes in a nested, tube-in-tube structure.
Ball grid arrayA ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Potential applications of carbon nanotubesCarbon nanotubes (CNTs) are cylinders of one or more layers of graphene (lattice). Diameters of single-walled carbon nanotubes (SWNTs) and multi-walled carbon nanotubes (MWNTs) are typically 0.8 to 2 nm and 5 to 20 nm, respectively, although MWNT diameters can exceed 100 nm. CNT lengths range from less than 100 nm to 0.5 m. Individual CNT walls can be metallic or semiconducting depending on the orientation of the lattice with respect to the tube axis, which is called chirality.
Flow process chartThe flow process chart is a graphical and symbolic representation of the activities performed on the work piece during the operation in industrial engineering. The first structured method for documenting process flow, e.g., in flow shop scheduling, the flow process chart, was introduced by Frank and Lillian Gilbreth to members of ASME in 1921 as the presentation "Process Charts, First Steps in Finding the One Best Way to Do Work". The Gilbreths' tools quickly found their way into industrial engineering curricula.
Associative arrayIn computer science, an associative array, map, symbol table, or dictionary is an abstract data type that stores a collection of (key, value) pairs, such that each possible key appears at most once in the collection. In mathematical terms, an associative array is a function with finite domain. It supports 'lookup', 'remove', and 'insert' operations. The dictionary problem is the classic problem of designing efficient data structures that implement associative arrays.
Acrylate polymerAn acrylate polymer (also known as acrylic or polyacrylate) is any of a group of polymers prepared from acrylate monomers. These plastics are noted for their transparency, resistance to breakage, and elasticity. Acrylate polymer is commonly used in cosmetics, such as nail polish, as an adhesive. The first synthesis of acrylic polymer was reported by G.W.A Kahlbaum in 1880. Acrylic elastomer is a general term for a type of synthetic rubber whose primary component is acrylic acid alkylester (ethyl or butyl ester).
AblationAblation (ablatio – removal) is the removal or destruction of something from an object by vaporization, chipping, erosive processes, or by other means. Examples of ablative materials are described below, including spacecraft material for ascent and atmospheric reentry, ice and snow in glaciology, biological tissues in medicine and passive fire protection materials. In artificial intelligence (AI), especially machine learning, ablation is the removal of a component of an AI system.
