Publication

Fine Pitch 3D-TSV Based High Frequency Components for RF MEMS Applications

Related publications (29)

Unraveling the Electrochemical Electrode Coupling in Integrated Organic Electrochemical Transistors

Organic electrochemical transistors (OECTs) have gained enormous attention due to their potential for bioelectronics and neuromorphic computing. However, their implementation into real-world applications is still impeded by a lack of understanding of the c ...

WILEY-V C H VERLAG GMBH2023

Biodegradable materials as sensitive coatings for humidity sensing in S-band microwave frequencies

Danick Briand, James Alec Pierce Bourely, Nicolas Francis Fumeaux, Leticia de Sousa, Oleksandr Vorobyov

Worldwide, electronic waste represents the fastest-growing stream of waste. With an increasing number of connected devices, passive and eco-friendly environmental sensing solutions need to be developed. Wireless passive devices for RFID and sensing exist, ...

2023

Dual-Polarized SIW Slot Antenna Using ENZ Metamaterial for 5G and mmWave Applications

Romain Christophe Rémy Fleury, Amir Jafargholi

This paper presents a broadband dual-polarized substrate integrated waveguide (SIW) slot antenna. It is analytically shown that by decreasing the permittivity of a dielectricloaded slot antenna, the resulting bandwidth increases significantly, where the wi ...

IEEE2023

Cavity-Mediated Coupling of Terahertz Antiferromagnetic Resonators

Jean-Philippe Ansermet, Marcin Bialek

Coupling of space-separated resonators is interesting for quantum and communication technologies. In this work, we show that antiferromagnetic resonance in separated parallel-plane slabs of hematite (alpha-Fe2O3) couple cooperatively to terahertz electroma ...

American Physical Society (APS)2023

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

2D Nanosystems: Applications of 2D Semiconductors for In-Memory Computing

Guilherme Migliato Marega

Machine learning and data processing algorithms have been thriving in finding ways of processing and classifying information by exploiting the hidden trends of large datasets. Although these emerging computational methods have become successful in today's ...

EPFL2023

Frontiers in the Application of RF Vacuum Electronics

Timothy Goodman

The application of radio frequency (RF) vacuum electronics for the betterment of the human condition began soon after the invention of the first vacuum tubes in the 1920s and has not stopped since. Today, microwave vacuum devices are powering important app ...

2023

Exploring brain-inspired multi-core heterogeneous hardware templates for low-power biomedical embedded systems

Benoît Walter Denkinger

The miniaturization of integrated circuits (ICs) and their higher performance and energy efficiency, combined with new machine learning algorithms and applications, have paved the way to intelligent, interconnected edge devices. In the medical domain, they ...

EPFL2023

Electronic metadevices for terahertz applications

Elison de Nazareth Matioli, Mohammad Samizadeh Nikooytabalvandani

The evolution of electronics has largely relied on downscaling to meet the continuous needs for faster and highly integrated devices(1). As the channel length is reduced, however, classic electronic devices face fundamental issues that hinder exploiting ma ...

NATURE PORTFOLIO2023