Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Wafer-level packagingWafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.
Very Large Scale IntegrationVery large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit (Metal Oxide Semiconductor) chips were developed and then widely adopted, enabling complex semiconductor and telecommunication technologies. The microprocessor and memory chips are VLSI devices. Before the introduction of VLSI technology, most ICs had a limited set of functions they could perform.
Die shrinkThe term die shrink (sometimes optical shrink or process shrink) refers to the scaling of metal–oxide–semiconductor (MOS) devices. The act of shrinking a die creates a somewhat identical circuit using a more advanced fabrication process, usually involving an advance of lithographic nodes. This reduces overall costs for a chip company, as the absence of major architectural changes to the processor lowers research and development costs while at the same time allowing more processor dies to be manufactured on the same piece of silicon wafer, resulting in less cost per product sold.
Apple siliconApple silicon is a series of system on a chip (SoC) and system in a package (SiP) processors designed by Apple Inc., mainly using the ARM architecture. They are the basis of Mac, iPhone, iPad, Apple TV, Apple Watch, AirPods, AirTag, HomePod, and Apple Vision Pro devices. Apple announced its plan to switch Mac computers from Intel processors to Apple silicon at WWDC 2020 on June 22, 2020. The first Macs built with the Apple M1 chip were unveiled on November 10, 2020. As of June 2023, the entire Mac lineup uses Apple silicon chips.
Compact discThe compact disc (CD) is a digital optical disc data storage format that was co-developed by Philips and Sony to store and play digital audio recordings. In August 1982, the first compact disc was manufactured. It was then released in October 1982 in Japan and branded as Digital Audio Compact Disc. It was released on March 2, 1983 in North America and Europe. The format was later adapted (as CD-ROM) for general-purpose data storage.
High-performance computingHigh-performance computing (HPC) uses supercomputers and computer clusters to solve advanced computation problems. HPC integrates systems administration (including network and security knowledge) and parallel programming into a multidisciplinary field that combines digital electronics, computer architecture, system software, programming languages, algorithms and computational techniques. HPC technologies are the tools and systems used to implement and create high performance computing systems.
Silicon nitrideSilicon nitride is a chemical compound of the elements silicon and nitrogen. Si3N4 (Trisilicon tetranitride) is the most thermodynamically stable and commercially important of the silicon nitrides, and the term ′′Silicon nitride′′ commonly refers to this specific composition. It is a white, high-melting-point solid that is relatively chemically inert, being attacked by dilute HF and hot H3PO4. It is very hard (8.5 on the mohs scale). It has a high thermal stability with strong optical nonlinearities for all-optical applications.
ManufacturingManufacturing is the creation or production of goods with the help of equipment, labor, machines, tools, and chemical or biological processing or formulation. It is the essence of the secondary sector of the economy. The term may refer to a range of human activity, from handicraft to high-tech, but it is most commonly applied to industrial design, in which raw materials from the primary sector are transformed into finished goods on a large scale.
Computer performanceIn computing, computer performance is the amount of useful work accomplished by a computer system. Outside of specific contexts, computer performance is estimated in terms of accuracy, efficiency and speed of executing computer program instructions. When it comes to high computer performance, one or more of the following factors might be involved: Short response time for a given piece of work. High throughput (rate of processing work). Low utilization of computing resource(s). Fast (or highly compact) data compression and decompression.
Compact Disc Digital AudioCompact Disc Digital Audio (CDDA or CD-DA), also known as Digital Audio Compact Disc or simply as Audio CD, is the standard format for audio compact discs. The standard is defined in the Red Book, one of a series of Rainbow Books (named for their binding colors) that contain the technical specifications for all CD formats. The first commercially available audio CD player, the Sony CDP-101, was released in October 1982 in Japan. The format gained worldwide acceptance in 1983–84, selling more than a million CD players in those two years, to play 22.
Silicon carbideSilicon carbide (SiC), also known as carborundum (ˌkɑrbəˈrʌndəm), is a hard chemical compound containing silicon and carbon. A semiconductor, it occurs in nature as the extremely rare mineral moissanite, but has been mass-produced as a powder and crystal since 1893 for use as an abrasive. Grains of silicon carbide can be bonded together by sintering to form very hard ceramics that are widely used in applications requiring high endurance, such as car brakes, car clutches and ceramic plates in bulletproof vests.
Computer-aided manufacturingComputer-aided manufacturing (CAM) also known as computer-aided modeling or computer-aided machining is the use of software to control machine tools in the manufacturing of work pieces. This is not the only definition for CAM, but it is the most common. It may also refer to the use of a computer to assist in all operations of a manufacturing plant, including planning, management, transportation and storage.
ScalabilityScalability is the property of a system to handle a growing amount of work. One definition for software systems specifies that this may be done by adding resources to the system. In an economic context, a scalable business model implies that a company can increase sales given increased resources. For example, a package delivery system is scalable because more packages can be delivered by adding more delivery vehicles.
SupercomputerA supercomputer is a computer with a high level of performance as compared to a general-purpose computer. The performance of a supercomputer is commonly measured in floating-point operations per second (FLOPS) instead of million instructions per second (MIPS). Since 2017, there have existed supercomputers which can perform over 1017 FLOPS (a hundred quadrillion FLOPS, 100 petaFLOPS or 100 PFLOPS). For comparison, a desktop computer has performance in the range of hundreds of gigaFLOPS (1011) to tens of teraFLOPS (1013).
Etching (microfabrication)Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography. Other situations require a more durable mask, such as silicon nitride.
Silicon–germaniumSiGe (ˈsɪɡiː or ˈsaɪdʒiː), or silicon–germanium, is an alloy with any molar ratio of silicon and germanium, i.e. with a molecular formula of the form Si1−xGex. It is commonly used as a semiconductor material in integrated circuits (ICs) for heterojunction bipolar transistors or as a strain-inducing layer for CMOS transistors. IBM introduced the technology into mainstream manufacturing in 1989. This relatively new technology offers opportunities in mixed-signal circuit and analog circuit IC design and manufacture.
