Network on a chipA network on a chip or network-on-chip (NoC ˌɛnˌoʊˈsiː or nɒk ) is a network-based communications subsystem on an integrated circuit ("microchip"), most typically between modules in a system on a chip (SoC). The modules on the IC are typically semiconductor IP cores schematizing various functions of the computer system, and are designed to be modular in the sense of network science. The network on chip is a router-based packet switching network between SoC modules.
Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
Optical computingOptical computing or photonic computing uses light waves produced by lasers or incoherent sources for data processing, data storage or data communication for computing. For decades, photons have shown promise to enable a higher bandwidth than the electrons used in conventional computers (see optical fibers). Most research projects focus on replacing current computer components with optical equivalents, resulting in an optical digital computer system processing binary data.
Package on a packagePackage on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations.
Bus (computing)In computer architecture, a bus (shortened form of the Latin omnibus, and historically also called data highway or databus) is a communication system that transfers data between components inside a computer, or between computers. This expression covers all related hardware components (wire, optical fiber, etc.) and software, including communication protocols. Early computer buses were parallel electrical wires with multiple hardware connections, but the term is now used for any physical arrangement that provides the same logical function as a parallel electrical busbar.
Serial communicationIn telecommunication and data transmission, serial communication is the process of sending data one bit at a time, sequentially, over a communication channel or computer bus. This is in contrast to parallel communication, where several bits are sent as a whole, on a link with several parallel channels. Serial communication is used for all long-haul communication and most computer networks, where the cost of cable and synchronization difficulties make parallel communication impractical.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Through-silicon viaIn electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
Physical layerIn the seven-layer OSI model of computer networking, the physical layer or layer 1 is the first and lowest layer: the layer most closely associated with the physical connection between devices. The physical layer provides an electrical, mechanical, and procedural interface to the transmission medium. The shapes and properties of the electrical connectors, the frequencies to broadcast on, the line code to use and similar low-level parameters, are specified by the physical layer.
Integrated circuit packagingIn electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Pulse-width modulationPulse-width modulation (PWM), or pulse-duration modulation (PDM), is a method of controlling the average power delivered by an electrical signal. The average value of voltage (and current) fed to the load is controlled by switching the supply between 0 and 100% at a rate faster than it takes the load to change significantly. The longer the switch is on, the higher the total power supplied to the load. Along with maximum power point tracking (MPPT), it is one of the primary methods of controlling the output of solar panels to that which can be utilized by a battery.
PCI ExpressPCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X and AGP bus standards. It is the common motherboard interface for personal computers' graphics cards, sound cards, hard disk drive host adapters, SSDs, Wi-Fi and Ethernet hardware connections.
Optical fiberAn optical fiber, or optical fibre in Commonwealth English, is a flexible, transparent fiber made by drawing glass (silica) or plastic to a diameter slightly thicker than that of a human hair. Optical fibers are used most often as a means to transmit light between the two ends of the fiber and find wide usage in fiber-optic communications, where they permit transmission over longer distances and at higher bandwidths (data transfer rates) than electrical cables.
Pulse-code modulationPulse-code modulation (PCM) is a method used to digitally represent sampled analog signals. It is the standard form of digital audio in computers, compact discs, digital telephony and other digital audio applications. In a PCM stream, the amplitude of the analog signal is sampled at uniform intervals, and each sample is quantized to the nearest value within a range of digital steps. Linear pulse-code modulation (LPCM) is a specific type of PCM in which the quantization levels are linearly uniform.
Optical transistorAn optical transistor, also known as an optical switch or a light valve, is a device that switches or amplifies optical signals. Light occurring on an optical transistor's input changes the intensity of light emitted from the transistor's output while output power is supplied by an additional optical source. Since the input signal intensity may be weaker than that of the source, an optical transistor amplifies the optical signal. The device is the optical analog of the electronic transistor that forms the basis of modern electronic devices.
Network throughputNetwork throughput (or just throughput, when in context) refers to the rate of message delivery over a communication channel, such as Ethernet or packet radio, in a communication network. The data that these messages contain may be delivered over physical or logical links, or through network nodes. Throughput is usually measured in bits per second (bit/s or bps), and sometimes in data packets per second (p/s or pps) or data packets per time slot. The system throughput or aggregate throughput is the sum of the data rates that are delivered to all terminals in a network.
Interconnect bottleneckThe interconnect bottleneck comprises limits on integrated circuit (IC) performance due to connections between components instead of their internal speed. In 2006 it was predicted to be a "looming crisis" by 2010. Improved performance of computer systems has been achieved, in large part, by downscaling the IC minimum feature size. This allows the basic IC building block, the transistor, to operate at a higher frequency, performing more computations per second.
PhotodiodeA photodiode is a light-sensitive semiconductor diode. It produces current when it absorbs photons. The package of a photodiode allows light (or infrared or ultraviolet radiation, or X-rays) to reach the sensitive part of the device. The package may include lenses or optical filters. Devices designed for use specially as a photodiode use a PIN junction rather than a p–n junction, to increase the speed of response. Photodiodes usually have a slower response time as their surface area increases.
Low-power electronicsLow-power electronics are electronics, such as notebook processors, that have been designed to use less electric power than usual, often at some expense. In the case of notebook processors, this expense is processing power; notebook processors usually consume less power than their desktop counterparts, at the expense of lower processing power. watch The earliest attempts to reduce the amount of power required by an electronic device were related to the development of the wristwatch.
