Structural loadA structural load or structural action is a force, deformation, or acceleration applied to structural elements. A load causes stress, deformation, and displacement in a structure. Structural analysis, a discipline in engineering, analyzes the effects of loads on structures and structural elements. Excess load may cause structural failure, so this should be considered and controlled during the design of a structure. Particular mechanical structures—such as aircraft, satellites, rockets, space stations, ships, and submarines—are subject to their own particular structural loads and actions.
Beam (structure)A beam is a structural element that primarily resists loads applied laterally to the beam's axis (an element designed to carry primarily axial load would be a strut or column). Its mode of deflection is primarily by bending. The loads applied to the beam result in reaction forces at the beam's support points. The total effect of all the forces acting on the beam is to produce shear forces and bending moments within the beams, that in turn induce internal stresses, strains and deflections of the beam.
Quad flat packageA quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP). The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies.
Ceramic glazeCeramic glaze, or simply glaze, is a glassy coating on ceramics. It is used for decoration, to ensure the item is impermeable to liquids and to minimise the adherence of pollutants. Glazing renders earthenware impermeable to water, sealing the inherent porosity of biscuit earthenware. It also gives a tougher surface. Glaze is also used on stoneware and porcelain. In addition to their functionality, glazes can form a variety of surface finishes, including degrees of glossy or matte finish and color.
Film capacitorFilm capacitors, plastic film capacitors, film dielectric capacitors, or polymer film capacitors, generically called film caps as well as power film capacitors, are electrical capacitors with an insulating plastic film as the dielectric, sometimes combined with paper as carrier of the electrodes. The dielectric films, depending on the desired dielectric strength, are drawn in a special process to an extremely thin thickness, and are then provided with electrodes.
Nanoelectromechanical systemsNanoelectromechanical systems (NEMS) are a class of devices integrating electrical and mechanical functionality on the nanoscale. NEMS form the next logical miniaturization step from so-called microelectromechanical systems, or MEMS devices. NEMS typically integrate transistor-like nanoelectronics with mechanical actuators, pumps, or motors, and may thereby form physical, biological, and chemical sensors.
3D scanning3D scanner is the process of analyzing a real-world object or environment to collect three dimensional data of its shape and possibly its appearance (e.g. color). The collected data can then be used to construct digital 3D models. A 3D scanner can be based on many different technologies, each with its own limitations, advantages and costs. Many limitations in the kind of objects that can be digitised are still present. For example, optical technology may encounter many difficulties with dark, shiny, reflective or transparent objects.
Polymer capacitorA polymer capacitor, or more accurately a polymer electrolytic capacitor, is an electrolytic capacitor (e-cap) with a solid conductive polymer electrolyte. There are four different types: Polymer tantalum electrolytic capacitor (Polymer Ta-e-cap) Polymer aluminium electrolytic capacitor (Polymer Al-e-cap) Hybrid polymer capacitor (Hybrid polymer Al-e-cap) Polymer niobium electrolytic capacitors Polymer Ta-e-caps are available in rectangular surface-mounted device (SMD) chip style.
3D printing3D printing or additive manufacturing is the construction of a three-dimensional object from a CAD model or a digital 3D model. It can be done in a variety of processes in which material is deposited, joined or solidified under computer control, with material being added together (such as plastics, liquids or powder grains being fused), typically layer by layer. In the 1980s, 3D printing techniques were considered suitable only for the production of functional or aesthetic prototypes, and a more appropriate term for it at the time was rapid prototyping.
Electrical loadAn electrical load is an electrical component or portion of a circuit that consumes (active) electric power, such as electrical appliances and lights inside the home. The term may also refer to the power consumed by a circuit. This is opposed to a power source, such as a battery or generator, which produces power. The term is used more broadly in electronics for a device connected to a signal source, whether or not it consumes power.
PotteryPottery is the process and the products of forming vessels and other objects with clay and other raw materials, which are fired at high temperatures to give them a hard and durable form. The place where such wares are made by a potter is also called a pottery (plural potteries). The definition of pottery, used by the ASTM International, is "all fired ceramic wares that contain clay when formed, except technical, structural, and refractory products".
Field electron emissionField electron emission, also known as field emission (FE) and electron field emission, is emission of electrons induced by an electrostatic field. The most common context is field emission from a solid surface into a vacuum. However, field emission can take place from solid or liquid surfaces, into a vacuum, a fluid (e.g. air), or any non-conducting or weakly conducting dielectric. The field-induced promotion of electrons from the valence to conduction band of semiconductors (the Zener effect) can also be regarded as a form of field emission.
