Input impedanceThe input impedance of an electrical network is the measure of the opposition to current (impedance), both static (resistance) and dynamic (reactance), into a load network that is external to the electrical source network. The input admittance (the reciprocal of impedance) is a measure of the load network's propensity to draw current. The source network is the portion of the network that transmits power, and the load network is the portion of the network that consumes power.
Output impedanceThe output impedance of an electrical network is the measure of the opposition to current flow (impedance), both static (resistance) and dynamic (reactance), into the load network being connected that is internal to the electrical source. The output impedance is a measure of the source's propensity to drop in voltage when the load draws current, the source network being the portion of the network that transmits and the load network being the portion of the network that consumes.
Impedance matchingIn electronics, impedance matching is the practice of designing or adjusting the input impedance or output impedance of an electrical device for a desired value. Often, the desired value is selected to maximize power transfer or minimize signal reflection. For example, impedance matching typically is used to improve power transfer from a radio transmitter via the interconnecting transmission line to the antenna. Signals on a transmission line will be transmitted without reflections if the transmission line is terminated with a matching impedance.
Impedance bridgingIn audio engineering and sound recording, a high impedance bridging, voltage bridging, or simply bridging connection is one in which the load impedance is much larger than the source impedance. The load measures the source's voltage while minimally drawing current or affecting it. When the output of a device (consisting of the voltage source VS and output impedance ZS in illustration) is connected to the input of another device (the load impedance ZL in the illustration), these two impedances form a voltage divider: One can maximize the signal level VL by using a voltage source whose output impedance ZS is as small as possible and by using a receiving device whose input impedance ZL is as large as possible.
Distributed-element circuitDistributed-element circuits are electrical circuits composed of lengths of transmission lines or other distributed components. These circuits perform the same functions as conventional circuits composed of passive components, such as capacitors, inductors, and transformers. They are used mostly at microwave frequencies, where conventional components are difficult (or impossible) to implement. Conventional circuits consist of individual components manufactured separately then connected together with a conducting medium.
Electrical impedanceIn electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit. Quantitatively, the impedance of a two-terminal circuit element is the ratio of the complex representation of the sinusoidal voltage between its terminals, to the complex representation of the current flowing through it. In general, it depends upon the frequency of the sinusoidal voltage.
Waveguide filterA waveguide filter is an electronic filter constructed with waveguide technology. Waveguides are hollow metal conduits inside which an electromagnetic wave may be transmitted. Filters are devices used to allow signals at some frequencies to pass (the passband), while others are rejected (the stopband). Filters are a basic component of electronic engineering designs and have numerous applications. These include selection of signals and limitation of noise.
MicrofabricationMicrofabrication is the process of fabricating miniature structures of micrometre scales and smaller. Historically, the earliest microfabrication processes were used for integrated circuit fabrication, also known as "semiconductor manufacturing" or "semiconductor device fabrication". In the last two decades microelectromechanical systems (MEMS), microsystems (European usage), micromachines (Japanese terminology) and their subfields, microfluidics/lab-on-a-chip, optical MEMS (also called MOEMS), RF MEMS, PowerMEMS, BioMEMS and their extension into nanoscale (for example NEMS, for nano electro mechanical systems) have re-used, adapted or extended microfabrication methods.
MEMSMEMS (Microelectromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2.
Pressure measurementPressure measurement is the measurement of an applied force by a fluid (liquid or gas) on a surface. Pressure is typically measured in units of force per unit of surface area. Many techniques have been developed for the measurement of pressure and vacuum. Instruments used to measure and display pressure mechanically are called pressure gauges, vacuum gauges or compound gauges (vacuum & pressure). The widely used Bourdon gauge is a mechanical device, which both measures and indicates and is probably the best known type of gauge.
Smith chartThe Smith chart (sometimes also called Smith diagram, Mizuhashi chart (水橋チャート), Mizuhashi–Smith chart (水橋スミスチャート), Volpert–Smith chart (Диаграмма Вольперта—Смита) or Mizuhashi–Volpert–Smith chart), is a graphical calculator or nomogram designed for electrical and electronics engineers specializing in radio frequency (RF) engineering to assist in solving problems with transmission lines and matching circuits. It was independently proposed by Tōsaku Mizuhashi (水橋東作) in 1937, and by Amiel R. Volpert (Амиэ́ль Р.
PhotolithographyIn integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Typically, ultraviolet light is used to transfer a geometric design from an optical mask to a light-sensitive chemical (photoresist) coated on the substrate.
Extreme ultraviolet lithographyExtreme ultraviolet lithography (also known as EUV or EUVL) is an optical lithography technology used in semiconductor device fabrication to make integrated circuits (ICs). It uses extreme ultraviolet (EUV) wavelengths near 13.5 nm, using a laser-pulsed tin (Sn) droplet plasma (Sn ions in the ionic states from Sn IX to Sn XIV give photon emission spectral peaks around 13.5 nm from 4p64dn - 4p54dn+1 + 4dn-14f ionic state transitions.), to produce a pattern by using a reflective photomask to expose a substrate covered by photoresist.
Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
