Publication

Tailoring of Optical Properties of Alumina films deposited by High Vacuum CVD (HV-CVD)

Patrik Willi Hoffmann
2009
Conference Papers

Abstract

The deposition of amorphous alumina (Al2O3) films on four inch wafers with high deposition rate (up to 50 nm/min) by an advanced HV-CVD technique is discussed. Amorphous nature of the films is confirmed by X-ray diffraction. Refractive index of the deposited alumina can be adjusted in the large range (1.3-1.62@633 nm) by varying the substrate temperate during the deposition. The films are highly transparent. The density and stoichiometry of the deposits are also influenced by deposition conditions. Presence of -OH groups is observed in some cases.

Official source

https://infoscience.epfl.ch/entities/publication/d3ccbfd1-1009-4bae-aa74-447f22d1c1ba

About this result

This page is automatically generated and may contain information that is not correct, complete, up-to-date, or relevant to your search query. The same applies to every other page on this website. Please make sure to verify the information with EPFL's official sources.

Graph Chat

Chat with Graph Search

Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.

DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.

Patrik Willi Hoffmann
2009
Conference Papers

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/d3ccbfd1-1009-4bae-aa74-447f22d1c1ba

About this result

Related concepts (32)

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Electron-beam physical vapor deposition

Electron-beam physical vapor deposition, or EBPVD, is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a charged tungsten filament under high vacuum. The electron beam causes atoms from the target to transform into the gaseous phase. These atoms then precipitate into solid form, coating everything in the vacuum chamber (within line of sight) with a thin layer of the anode material.

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

Related publications (30)

Tailoring of Optical Properties of Alumina films deposited by High Vacuum CVD (HV-CVD)

Chat with Graph Search

Impact of relative humidity on the optical properties of sol–gel processed black spinel oxide coatings for solar absorbers

Exploiting Two‐Photon Lithography, Deposition, and Processing to Realize Complex 3D Magnetic Nanostructures

Single‐Crystalline Lateral p ‐SnS/ n ‐SnSe van der Waals Heterostructures by Vapor Transport Growth with In Situ Bi Doping