Publication

3-D structuration of LTCC for Sensor Micro-fluidic Applications

Thomas Maeder, Peter Ryser
2004
Conference Papers

Abstract

Low Temperature Co-fired Ceramic (LTCC) Technology is recentlyaddressed to be a key approach among advanced packaging technologies, offering many advantages over its competitors. One of its most attractivefeatures is the ease of 3-D structuration thanks to the LTCC green tapes. These tapes can be easily cut into desired forms in the way to realize bothstructural and electrical functions under a single system. Three dimensional structures such as membranes, channels can be achieved either by cuttingand laminating LTCC tapes or by using a sacrificial layer. In this work, we demonstrate fabrication of an LTCC micro-fluidic sensor using carbon-paste as the sacrificial layer. The results indicate extremely fine-sized structural dimensions without deformation, which are attractive for pressureor thermal sensor applications.

Official source

https://infoscience.epfl.ch/entities/publication/ce44bd7e-e2ed-445a-9ca7-d455faa4c909

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Thomas Maeder, Peter Ryser
2004
Conference Papers

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/ce44bd7e-e2ed-445a-9ca7-d455faa4c909

About this result

Related concepts (27)

Semiconductor device fabrication

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.

System in a package

A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and/or embedded in the substrate. The SiP performs all or most of the functions of an electronic system, and is typically used when designing components for mobile phones, digital music players, etc.

Integrated circuit packaging

In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.

Related publications (7)

3-D structuration of LTCC for Sensor Micro-fluidic Applications

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