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This paper presents the cooling concept for a medium voltage modular multilevel converter cell. To optimize power density, the metallic enclosure is used to dissipate the heat generated by semiconductor losses, while maintaining maximum temperatures below desired levels. Design, simulation results, and several different prototypes are verified and validated experimentally for their performance.
François Maréchal, Luc Girardin, Bingqian Liu
Lyesse Laloui, Elena Ravera, Sofie Elaine ten Bosch