Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
Zero-energy buildingA Zero-Energy Building (ZEB), also known as a Net Zero-Energy (NZE) building, is a building with net zero energy consumption, meaning the total amount of energy used by the building on an annual basis is equal to the amount of renewable energy created on the site or in other definitions by renewable energy sources offsite, using technology such as heat pumps, high efficiency windows and insulation, and solar panels. The goal is that these buildings contribute less overall greenhouse gas to the atmosphere during operations than similar non-ZNE buildings.
3D printing3D printing or additive manufacturing is the construction of a three-dimensional object from a CAD model or a digital 3D model. It can be done in a variety of processes in which material is deposited, joined or solidified under computer control, with material being added together (such as plastics, liquids or powder grains being fused), typically layer by layer. In the 1980s, 3D printing techniques were considered suitable only for the production of functional or aesthetic prototypes, and a more appropriate term for it at the time was rapid prototyping.
Thermal energy storageThermal energy storage (TES) is achieved with widely different technologies. Depending on the specific technology, it allows excess thermal energy to be stored and used hours, days, months later, at scales ranging from the individual process, building, multiuser-building, district, town, or region. Usage examples are the balancing of energy demand between daytime and nighttime, storing summer heat for winter heating, or winter cold for summer air conditioning (Seasonal thermal energy storage).
Delay slotIn computer architecture, a delay slot is an instruction slot being executed without the effects of a preceding instruction. The most common form is a single arbitrary instruction located immediately after a branch instruction on a RISC or DSP architecture; this instruction will execute even if the preceding branch is taken. Thus, by design, the instructions appear to execute in an illogical or incorrect order. It is typical for assemblers to automatically reorder instructions by default, hiding the awkwardness from assembly developers and compilers.
Transistor modelTransistors are simple devices with complicated behavior. In order to ensure the reliable operation of circuits employing transistors, it is necessary to scientifically model the physical phenomena observed in their operation using transistor models. There exists a variety of different models that range in complexity and in purpose. Transistor models divide into two major groups: models for device design and models for circuit design. The modern transistor has an internal structure that exploits complex physical mechanisms.
Solar thermal energySolar thermal energy (STE) is a form of energy and a technology for harnessing solar energy to generate thermal energy for use in industry, and in the residential and commercial sectors. Solar thermal collectors are classified by the United States Energy Information Administration as low-, medium-, or high-temperature collectors. Low-temperature collectors are generally unglazed and used to heat swimming pools or to heat ventilation air. Medium-temperature collectors are also usually flat plates but are used for heating water or air for residential and commercial use.
Thermal power stationA thermal power station is a type of power station in which heat energy is converted to electrical energy. In a steam-generating cycle heat is used to boil water in a large pressure vessel to produce high-pressure steam, which drives a steam turbine connected to an electrical generator. The low-pressure exhaust from the turbine enters a steam condenser where it is cooled to produce hot condensate which is recycled to the heating process to generate more high pressure steam. This is known as a Rankine cycle.
Computer performanceIn computing, computer performance is the amount of useful work accomplished by a computer system. Outside of specific contexts, computer performance is estimated in terms of accuracy, efficiency and speed of executing computer program instructions. When it comes to high computer performance, one or more of the following factors might be involved: Short response time for a given piece of work. High throughput (rate of processing work). Low utilization of computing resource(s). Fast (or highly compact) data compression and decompression.
Thermal pollutionThermal pollution, sometimes called "thermal enrichment", is the degradation of water quality by any process that changes ambient water temperature. Thermal pollution is the rise or drop in the temperature of a natural body of water caused by human influence. Thermal pollution, unlike chemical pollution, results in a change in the physical properties of water. A common cause of thermal pollution is the use of water as a coolant by power plants and industrial manufacturers.
Dennard scalingIn semiconductor electronics, Dennard scaling, also known as MOSFET scaling, is a scaling law which states roughly that, as transistors get smaller, their power density stays constant, so that the power use stays in proportion with area; both voltage and current scale (downward) with length. The law, originally formulated for MOSFETs, is based on a 1974 paper co-authored by Robert H. Dennard, after whom it is named. Dennard's model of MOSFET scaling implies that, with every technology generation: Transistor dimensions could be scaled by −30% (0.
Thermal resistanceThermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. (Absolute) thermal resistance R in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. Specific thermal resistance or thermal resistivity Rλ in kelvin–metres per watt (K⋅m/W), is a material constant.
