Publication

MONOLITHIC INTEGRATION OF NANOMECHANICAL RESONATORS WITH CMOS CIRCUITRY: FULL-WAFER NANOPATTERNING BY NANOSTENCIL LITHOGRAPHY

2006
Reports

Abstract

For the purpose of integrating nanomechanical structures with CMOS circuitry, nanostencil lithography ensures parallel patterning for rapid processing at wafer scale and nanometer-sized features definition. Moreover, this patterning technique is compatible with CMOS substrates given that it does not alter circuitry performance. However, a major limitation in nanostencil lithography is gap-induced pattern blurring naturally occurring if a planar stencil is used in combination with a substrate containing topography (e.g. CMOS). This phenomenon has been characterized and a corrective technique is implemented in order to eliminate the blurring.

Official source

https://infoscience.epfl.ch/entities/publication/ac04324d-a841-4768-a921-0dd9cdff9ca4

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2006
Reports

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/ac04324d-a841-4768-a921-0dd9cdff9ca4

About this result

Related concepts (29)

CMOS

Complementary metal–oxide–semiconductor (CMOS, pronounced "sea-moss", siːmɑːs, -ɒs) is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips (including CMOS BIOS), and other digital logic circuits.

Integrated circuit

An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.

Three-dimensional integrated circuit

A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.

Related publications (26)

MONOLITHIC INTEGRATION OF NANOMECHANICAL RESONATORS WITH CMOS CIRCUITRY: FULL-WAFER NANOPATTERNING BY NANOSTENCIL LITHOGRAPHY

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