Publication

Combinatorial HV-CVD survey of barium triisopropyl cyclopentadienyl and titanium tetraisopropoxide for the deposition of BaTiO3

Patrik Willi Hoffmann, Yury Kuzminykh, Michael Oliver Reinke
2015
Journal Articles

Abstract

Barium titanate is a very promising material for the integration of optical communication into electronic integrated circuits. For a successful integration into CMOS compatible technology, a growth process has to be found which allows forming crystalline BaTiO3 at sufficiently low temperatures. We describe the combinatorial analysis of BaTiO3 formation by high vacuum chemical vapor deposition using barium triisopropyl cyclopentadienyl and titanium tetraisopropoxide as metal sources; water, oxygen, or ozone are used as oxidizing agents. We analyzed the impact of these oxidizing agents on the interaction of the precursor molecules on the substrate surface. Furthermore, we characterized the films concerning chemical composition and identified growth conditions leading to deposit composition corresponding to the stoichiometric BaTiO3 formation. XRD analysis confirms the formation of crystalline BaTiO3 phases for deposition temperatures as low as 370 °C.

Official source

https://infoscience.epfl.ch/entities/publication/a64c96f6-2623-405a-a4cb-72e75c788991

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Patrik Willi Hoffmann, Yury Kuzminykh, Michael Oliver Reinke
2015
Journal Articles

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/a64c96f6-2623-405a-a4cb-72e75c788991

About this result

Related concepts (32)

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

Evaporation (deposition)

Evaporation is a common method of thin-film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel directly to the target object (substrate), where they condense back to a solid state. Evaporation is used in microfabrication, and to make macro-scale products such as metallized plastic film. Evaporation involves two basic processes: a hot source material evaporates and condenses on the substrate. It resembles the familiar process by which liquid water appears on the lid of a boiling pot.

Related publications (32)

Combinatorial HV-CVD survey of barium triisopropyl cyclopentadienyl and titanium tetraisopropoxide for the deposition of BaTiO3

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