Publication

Development of novel low temperature bonding technologies for microchip chemical analysis applications

Martinus Adela Maria Gijs, Abdeljalil Sayah, Dominique Solignac
2000
Journal Articles

Abstract

We introduce two new low temperature bonding technologies for the assembly of microstructured glass substrates for the realisation of microchannels for miniaturised chemical analysis applications. A first method consists of a proper cleaning of the two glass surfaces, followed by a simple epoxy gluing process at 90°C. In a second method, direct bonding is obtained just by exposing the glass stack to a high pressure (up to 50 MPa) in the 100-200°C temperature range. We obtain bonding strengths as high as 10 MPa, higher than the best values obtained by HF-assisted or plasma-assisted bonding. For the realisation of the microchannels, we introduce, besides the well-known HF-etching technology, two simple alternative methods, namely, sawing and micropowder blasting.

Official source

https://infoscience.epfl.ch/entities/publication/a6162190-5fb2-47e5-99f8-a866e9ff7cbd

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Martinus Adela Maria Gijs, Abdeljalil Sayah, Dominique Solignac
2000
Journal Articles

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/a6162190-5fb2-47e5-99f8-a866e9ff7cbd

About this result

Related concepts (32)

Chemical bond

A chemical bond is a lasting attraction between atoms or ions that enables the formation of molecules, crystals, and other structures. The bond may result from the electrostatic force between oppositely charged ions as in ionic bonds, or through the sharing of electrons as in covalent bonds. The strength of chemical bonds varies considerably; there are "strong bonds" or "primary bonds" such as covalent, ionic and metallic bonds, and "weak bonds" or "secondary bonds" such as dipole–dipole interactions, the London dispersion force, and hydrogen bonding.

Microfluidics

Microfluidics refers to a system that manipulates a small amount of fluids ((10−9 to 10−18 liters) using small channels with sizes ten to hundreds micrometres. It is a multidisciplinary field that involves molecular analysis, biodefence, molecular biology, and microelectronics. It has practical applications in the design of systems that process low volumes of fluids to achieve multiplexing, automation, and high-throughput screening.

Wire bonding

Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages.