Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
Negative temperatureCertain systems can achieve negative thermodynamic temperature; that is, their temperature can be expressed as a negative quantity on the Kelvin or Rankine scales. This should be distinguished from temperatures expressed as negative numbers on non-thermodynamic Celsius or Fahrenheit scales, which are nevertheless higher than absolute zero. The absolute temperature (Kelvin) scale can be understood loosely as a measure of average kinetic energy. Usually, system temperatures are positive.
Thermal conductionConduction is the process by which heat is transferred from the hotter end to the colder end of an object. The ability of the object to conduct heat is known as its thermal conductivity, and is denoted k. Heat spontaneously flows along a temperature gradient (i.e. from a hotter body to a colder body). For example, heat is conducted from the hotplate of an electric stove to the bottom of a saucepan in contact with it.
Passive daytime radiative coolingPassive daytime radiative cooling (PDRC) is a renewable cooling method proposed as a solution to global warming of enhancing terrestrial heat flow to outer space through the installation of thermally-emissive surfaces on Earth that require zero energy consumption or pollution. Because all materials in nature absorb more heat during the day than at night, PDRC surfaces are designed to be high in solar reflectance (to minimize heat gain) and strong in longwave infrared (LWIR) thermal radiation heat transfer through the atmosphere's infrared window (8–13 μm) to cool temperatures during the daytime.
Thermodynamic temperatureThermodynamic temperature is a quantity defined in thermodynamics as distinct from kinetic theory or statistical mechanics. Historically, thermodynamic temperature was defined by Lord Kelvin in terms of a macroscopic relation between thermodynamic work and heat transfer as defined in thermodynamics, but the kelvin was redefined by international agreement in 2019 in terms of phenomena that are now understood as manifestations of the kinetic energy of free motion of microscopic particles such as atoms, molecules, and electrons.
High-level synthesisHigh-level synthesis (HLS), sometimes referred to as C synthesis, electronic system-level (ESL) synthesis, algorithmic synthesis, or behavioral synthesis, is an automated design process that takes an abstract behavioral specification of a digital system and finds a register-transfer level structure that realizes the given behavior. Synthesis begins with a high-level specification of the problem, where behavior is generally decoupled from low-level circuit mechanics such as clock-level timing.
CompilerIn computing, a compiler is a computer program that translates computer code written in one programming language (the source language) into another language (the target language). The name "compiler" is primarily used for programs that translate source code from a high-level programming language to a low-level programming language (e.g. assembly language, object code, or machine code) to create an executable program. There are many different types of compilers which produce output in different useful forms.
Thermal resistanceThermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. (Absolute) thermal resistance R in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. Specific thermal resistance or thermal resistivity Rλ in kelvin–metres per watt (K⋅m/W), is a material constant.
Thermal contact conductanceIn physics, thermal contact conductance is the study of heat conduction between solid or liquid bodies in thermal contact. The thermal contact conductance coefficient, , is a property indicating the thermal conductivity, or ability to conduct heat, between two bodies in contact. The inverse of this property is termed thermal contact resistance. When two solid bodies come in contact, such as A and B in Figure 1, heat flows from the hotter body to the colder body.
Compiler-compilerIn computer science, a compiler-compiler or compiler generator is a programming tool that creates a parser, interpreter, or compiler from some form of formal description of a programming language and machine. The most common type of compiler-compiler is more precisely called a parser generator. It only handles syntactic analysis. The input of a parser generator is a grammar file, typically written in Backus–Naur form (BNF) or extended Backus–Naur form (EBNF) that defines the syntax of a target programming language.
Just-in-time compilationIn computing, just-in-time (JIT) compilation (also dynamic translation or run-time compilations) is compilation (of computer code) during execution of a program (at run time) rather than before execution. This may consist of source code translation but is more commonly bytecode translation to machine code, which is then executed directly. A system implementing a JIT compiler typically continuously analyses the code being executed and identifies parts of the code where the speedup gained from compilation or recompilation would outweigh the overhead of compiling that code.
SimulationA simulation is the imitation of the operation of a real-world process or system over time. Simulations require the use of models; the model represents the key characteristics or behaviors of the selected system or process, whereas the simulation represents the evolution of the model over time. Often, computers are used to execute the simulation. Simulation is used in many contexts, such as simulation of technology for performance tuning or optimizing, safety engineering, testing, training, education, and video games.
