Publication

Dispersion engineering of thick high-Q silicon nitride ring-resonators via atomic layer deposition

Tobias Kippenberg, Victor Brasch, Tobias Herr, Klaus Karl Hartinger
2012
Journal Articles

Abstract

We demonstrate dispersion engineering of integrated silicon nitride based ring resonators through conformal coating with hafnium dioxide deposited on top of the structures via atomic layer deposition. Both, magnitude and bandwidth of anomalous dispersion can be significantly increased. The results are confirmed by high resolution frequency-comb-assisted-diode-laser spectroscopy and are in very good agreement with the simulated modification of the mode spectrum. (C) 2012 Optical Society of America

Official source

https://infoscience.epfl.ch/entities/publication/a2eb9e5a-5696-4513-aee6-1978bc44b71c

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Tobias Kippenberg, Victor Brasch, Tobias Herr, Klaus Karl Hartinger
2012
Journal Articles

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/a2eb9e5a-5696-4513-aee6-1978bc44b71c

About this result

Related concepts (13)

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Pulsed laser deposition

Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.

Sputter deposition

Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K).

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Dispersion engineering of thick high-Q silicon nitride ring-resonators via atomic layer deposition

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