Differential signallingDifferential signalling is a method for electrically transmitting information using two complementary signals. The technique sends the same electrical signal as a differential pair of signals, each in its own conductor. The pair of conductors can be wires in a twisted-pair or ribbon cable or traces on a printed circuit board. Electrically, the two conductors carry voltage signals which are equal in magnitude, but of opposite polarity. The receiving circuit responds to the difference between the two signals, which results in a signal with a magnitude twice as large.
Circuit underutilizationCircuit underutilization also chip underutilization, programmable circuit underutilization, gate underutilization, logic block underutilization refers to a physical incomplete utility of semiconductor grade silicon on a standardized mass-produced circuit programmable chip, such as a gate array type ASIC, an FPGA, or a CPLD. In the example of a gate array, which may come in sizes of 5,000 or 10,000 gates, a design which utilizes even 5,001 gates would be required to use a 10,000 gate chip.
Integrated circuit packagingIn electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Logic gateA logic gate is an idealized or physical device that performs a Boolean function, a logical operation performed on one or more binary inputs that produces a single binary output. Depending on the context, the term may refer to an ideal logic gate, one that has, for instance, zero rise time and unlimited fan-out, or it may refer to a non-ideal physical device (see ideal and real op-amps for comparison). In the real world, the primary way of building logic gates uses diodes or transistors acting as electronic switches.
Front-side busThe front-side bus (FSB) is a computer communication interface (bus) that was often used in Intel-chip-based computers during the 1990s and 2000s. The EV6 bus served the same function for competing AMD CPUs. Both typically carry data between the central processing unit (CPU) and a memory controller hub, known as the northbridge. Depending on the implementation, some computers may also have a back-side bus that connects the CPU to the cache. This bus and the cache connected to it are faster than accessing the system memory (or RAM) via the front-side bus.
Asynchronous circuitAsynchronous circuit (clockless or self-timed circuit) is a sequential digital logic circuit that does not use a global clock circuit or signal generator to synchronize its components. Instead, the components are driven by a handshaking circuit which indicates a completion of a set of instructions. Handshaking works by simple data transfer protocols. Many synchronous circuits were developed in early 1950s as part of bigger asynchronous systems (e.g. ORDVAC).
PCI ExpressPCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X and AGP bus standards. It is the common motherboard interface for personal computers' graphics cards, sound cards, hard disk drive host adapters, SSDs, Wi-Fi and Ethernet hardware connections.
Low-voltage differential signalingLow-voltage differential signaling (LVDS), also known as TIA/EIA-644, is a technical standard that specifies electrical characteristics of a differential, serial signaling standard. LVDS operates at low power and can run at very high speeds using inexpensive twisted-pair copper cables. LVDS is a physical layer specification only; many data communication standards and applications use it and add a data link layer as defined in the OSI model on top of it.
Electronic system-level design and verificationElectronic system level (ESL) design and verification is an electronic design methodology, focused on higher abstraction level concerns. The term Electronic System Level or ESL Design was first defined by Gartner Dataquest, an EDA-industry-analysis firm, on February 1, 2001. It is defined in ESL Design and Verification as: "the utilization of appropriate abstractions in order to increase comprehension about a system, and to enhance the probability of a successful implementation of functionality in a cost-effective manner.
7400-series integrated circuitsThe 7400 series is a popular logic family of transistor–transistor logic (TTL) integrated circuits (ICs). In 1964, Texas Instruments introduced the SN5400 series of logic chips, in a ceramic semiconductor package. A low-cost plastic package SN7400 series was introduced in 1966 which quickly gained over 50% of the logic chip market, and eventually becoming de facto standardized electronic components. Over the decades, many generations of pin-compatible descendant families evolved to include support for low power CMOS technology, lower supply voltages, and surface mount packages.
Die (integrated circuit)A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: dice, dies, and die.
