Depletion and enhancement modesIn field-effect transistors (FETs), depletion mode and enhancement mode are two major transistor types, corresponding to whether the transistor is in an on state or an off state at zero gate–source voltage. Enhancement-mode MOSFETs (metal–oxide–semiconductor FETs) are the common switching elements in most integrated circuits. These devices are off at zero gate–source voltage. NMOS can be turned on by pulling the gate voltage higher than the source voltage, PMOS can be turned on by pulling the gate voltage lower than the source voltage.
Harmonic oscillatorIn classical mechanics, a harmonic oscillator is a system that, when displaced from its equilibrium position, experiences a restoring force F proportional to the displacement x: where k is a positive constant. If F is the only force acting on the system, the system is called a simple harmonic oscillator, and it undergoes simple harmonic motion: sinusoidal oscillations about the equilibrium point, with a constant amplitude and a constant frequency (which does not depend on the amplitude).
Parametric oscillatorA parametric oscillator is a driven harmonic oscillator in which the oscillations are driven by varying some parameter of the system at some frequency, typically different from the natural frequency of the oscillator. A simple example of a parametric oscillator is a child pumping a playground swing by periodically standing and squatting to increase the size of the swing's oscillations. The child's motions vary the moment of inertia of the swing as a pendulum. The "pump" motions of the child must be at twice the frequency of the swing's oscillations.
Semiconductor fabrication plantIn the microelectronics industry, a semiconductor fabrication plant (commonly called a fab; sometimes foundry) is a factory for semiconductor device fabrication. Fabs require many expensive devices to function. Estimates put the cost of building a new fab over one billion U.S. dollars with values as high as 3–4billionnotbeinguncommon.TSMCinvested9.3 billion in its Fab15 300 mm wafer manufacturing facility in Taiwan. The same company estimations suggest that their future fab might cost $20 billion. Q factorIn physics and engineering, the quality factor or Q factor is a dimensionless parameter that describes how underdamped an oscillator or resonator is. It is defined as the ratio of the initial energy stored in the resonator to the energy lost in one radian of the cycle of oscillation. Q factor is alternatively defined as the ratio of a resonator's centre frequency to its bandwidth when subject to an oscillating driving force. These two definitions give numerically similar, but not identical, results.
Helmholtz resonanceHelmholtz resonance or wind throb is the phenomenon of air resonance in a cavity, such as when one blows across the top of an empty bottle. The name comes from a device created in the 1850s by Hermann von Helmholtz, the Helmholtz resonator, which he used to identify the various frequencies or musical pitches present in music and other complex sounds. Helmholtz described in his 1862 book On the Sensations of Tone an apparatus able to pick out specific frequencies from a complex sound.
High frequencyHigh frequency (HF) is the ITU designation for the range of radio frequency electromagnetic waves (radio waves) between 3 and 30 megahertz (MHz). It is also known as the decameter band or decameter wave as its wavelengths range from one to ten decameters (ten to one hundred meters). Frequencies immediately below HF are denoted medium frequency (MF), while the next band of higher frequencies is known as the very high frequency (VHF) band. The HF band is a major part of the shortwave band of frequencies, so communication at these frequencies is often called shortwave radio.
Electronic filterElectronic filters are a type of signal processing filter in the form of electrical circuits. This article covers those filters consisting of lumped electronic components, as opposed to distributed-element filters. That is, using components and interconnections that, in analysis, can be considered to exist at a single point. These components can be in discrete packages or part of an integrated circuit. Electronic filters remove unwanted frequency components from the applied signal, enhance wanted ones, or both.
Acoustic metamaterialAn acoustic metamaterial, sonic crystal, or phononic crystal is a material designed to control, direct, and manipulate sound waves or phonons in gases, liquids, and solids (crystal lattices). Sound wave control is accomplished through manipulating parameters such as the bulk modulus β, density ρ, and chirality. They can be engineered to either transmit, or trap and amplify sound waves at certain frequencies. In the latter case, the material is an acoustic resonator.
Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
High-electron-mobility transistorA high-electron-mobility transistor (HEMT or HEM FET), also known as heterostructure FET (HFET) or modulation-doped FET (MODFET), is a field-effect transistor incorporating a junction between two materials with different band gaps (i.e. a heterojunction) as the channel instead of a doped region (as is generally the case for a MOSFET). A commonly used material combination is GaAs with AlGaAs, though there is wide variation, dependent on the application of the device.
Semiconductor packageA semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure.
