Monocrystalline siliconMonocrystalline silicon, more often called single-crystal silicon, in short mono c-Si or mono-Si, is the base material for silicon-based discrete components and integrated circuits used in virtually all modern electronic equipment. Mono-Si also serves as a photovoltaic, light-absorbing material in the manufacture of solar cells. It consists of silicon in which the crystal lattice of the entire solid is continuous, unbroken to its edges, and free of any grain boundaries (i.e. a single crystal).
Multilayer perceptronA multilayer perceptron (MLP) is a misnomer for a modern feedforward artificial neural network, consisting of fully connected neurons with a nonlinear kind of activation function, organized in at least three layers, notable for being able to distinguish data that is not linearly separable. It is a misnomer because the original perceptron used a Heaviside step function, instead of a nonlinear kind of activation function (used by modern networks).
Silicon carbideSilicon carbide (SiC), also known as carborundum (ˌkɑrbəˈrʌndəm), is a hard chemical compound containing silicon and carbon. A semiconductor, it occurs in nature as the extremely rare mineral moissanite, but has been mass-produced as a powder and crystal since 1893 for use as an abrasive. Grains of silicon carbide can be bonded together by sintering to form very hard ceramics that are widely used in applications requiring high endurance, such as car brakes, car clutches and ceramic plates in bulletproof vests.
Electrical engineeringElectrical engineering is an engineering discipline concerned with the study, design, and application of equipment, devices, and systems which use electricity, electronics, and electromagnetism. It emerged as an identifiable occupation in the latter half of the 19th century after the commercialization of the electric telegraph, the telephone, and electrical power generation, distribution, and use.
4000-series integrated circuitsThe 4000 series is a CMOS logic family of integrated circuits (ICs) first introduced in 1968 by RCA. It was slowly migrated into the 4000B buffered series after about 1975. It had a much wider supply voltage range than any contemporary logic family (3V to 18V recommended range for "B" series). Almost all IC manufacturers active during this initial era fabricated models for this series. Its naming convention is still in use today.
Bending momentIn solid mechanics, a bending moment is the reaction induced in a structural element when an external force or moment is applied to the element, causing the element to bend. The most common or simplest structural element subjected to bending moments is the beam. The diagram shows a beam which is simply supported (free to rotate and therefore lacking bending moments) at both ends; the ends can only react to the shear loads. Other beams can have both ends fixed (known as encastre beam); therefore each end support has both bending moments and shear reaction loads.
Electrical injuryElectrical injury is a physiological reaction caused by electric current passing through the body. The injury depends on the density of the current, tissue resistance and duration of contact. Very small currents may be imperceptible or produce a light tingling sensation. A shock caused by low and otherwise harmless current could startle an individual and cause injury due to jerking away or falling. Stronger currents may cause some degree of discomfort or pain, while more intense currents may induce involuntary muscle contractions, preventing the person from breaking free of the source of electricity.
Electrical breakdownIn electronics, electrical breakdown or dielectric breakdown is a process that occurs when an electrically insulating material (a dielectric), subjected to a high enough voltage, suddenly becomes a conductor and current flows through it. All insulating materials undergo breakdown when the electric field caused by an applied voltage exceeds the material's dielectric strength. The voltage at which a given insulating object becomes conductive is called its breakdown voltage and, in addition to its dielectric strength, depends on its size and shape, and the location on the object at which the voltage is applied.
Logic familyIn computer engineering, a logic family is one of two related concepts: A logic family of monolithic digital integrated circuit devices is a group of electronic logic gates constructed using one of several different designs, usually with compatible logic levels and power supply characteristics within a family. Many logic families were produced as individual components, each containing one or a few related basic logical functions, which could be used as "building-blocks" to create systems or as so-called "glue" to interconnect more complex integrated circuits.
OLEDAn organic light-emitting diode (OLED), also known as organic electroluminescent (organic EL) diode, is a light-emitting diode (LED) in which the emissive electroluminescent layer is a film of organic compound that emits light in response to an electric current. This organic layer is situated between two electrodes; typically, at least one of these electrodes is transparent. OLEDs are used to create digital displays in devices such as television screens, computer monitors, and portable systems such as smartphones and handheld game consoles.
Feedforward neural networkA feedforward neural network (FNN) is one of the two broad types of artificial neural network, characterized by direction of the flow of information between its layers. Its flow is uni-directional, meaning that the information in the model flows in only one direction—forward—from the input nodes, through the hidden nodes (if any) and to the output nodes, without any cycles or loops, in contrast to recurrent neural networks, which have a bi-directional flow.
Etching (microfabrication)Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography. Other situations require a more durable mask, such as silicon nitride.
