ScintillatorA scintillator ('sɪntɪleɪtər ) is a material that exhibits scintillation, the property of luminescence, when excited by ionizing radiation. Luminescent materials, when struck by an incoming particle, absorb its energy and scintillate (i.e. re-emit the absorbed energy in the form of light). Sometimes, the excited state is metastable, so the relaxation back down from the excited state to lower states is delayed (necessitating anywhere from a few nanoseconds to hours depending on the material).
Gamma spectroscopyGamma-ray spectroscopy is the qualitative study of the energy spectra of gamma-ray sources, such as in the nuclear industry, geochemical investigation, and astrophysics. Gamma-ray spectrometry, on the other hand, is the method used to acquire a quantitative spectrum measurement. Most radioactive sources produce gamma rays, which are of various energies and intensities. When these emissions are detected and analyzed with a spectroscopy system, a gamma-ray energy spectrum can be produced.
Scintillation counterA scintillation counter is an instrument for detecting and measuring ionizing radiation by using the excitation effect of incident radiation on a scintillating material, and detecting the resultant light pulses. It consists of a scintillator which generates photons in response to incident radiation, a sensitive photodetector (usually a photomultiplier tube (PMT), a charge-coupled device (CCD) camera, or a photodiode), which converts the light to an electrical signal and electronics to process this signal.
Active-pixel sensorAn active-pixel sensor (APS) is an , which was invented by Peter J.W. Noble in 1968, where each pixel sensor unit cell has a photodetector (typically a pinned photodiode) and one or more active transistors. In a metal–oxide–semiconductor (MOS) active-pixel sensor, MOS field-effect transistors (MOSFETs) are used as amplifiers. There are different types of APS, including the early NMOS APS and the now much more common complementary MOS (CMOS) APS, also known as the CMOS sensor.
BiCMOSBipolar CMOS (BiCMOS) is a semiconductor technology that integrates two semiconductor technologies, those of the bipolar junction transistor and the CMOS (complementary metal–oxide–semiconductor) logic gate, into a single integrated circuit. In more recent times the bipolar processes have been extended to include high mobility devices using silicon–germanium junctions.
Photomultiplier tubePhotomultiplier tubes (photomultipliers or PMTs for short) are extremely sensitive detectors of light in the ultraviolet, visible, and near-infrared ranges of the electromagnetic spectrum. They are members of the class of vacuum tubes, more specifically vacuum phototubes. These detectors multiply the current produced by incident light by as much as 100 million times or 108 (i.e., 160 dB), in multiple dynode stages, enabling (for example) individual photons to be detected when the incident flux of light is low.
Avalanche photodiodeAn avalanche photodiode (APD) is a highly sensitive semiconductor photodiode detector that exploits the photoelectric effect to convert light into electricity. From a functional standpoint, they can be regarded as the semiconductor analog of photomultiplier tubes. The avalanche photodiode (APD) was invented by Japanese engineer Jun-ichi Nishizawa in 1952. However, study of avalanche breakdown, microplasma defects in silicon and germanium and the investigation of optical detection using p-n junctions predate this patent.
Electron–positron annihilationElectron–positron annihilation occurs when an electron (_Electron) and a positron (_Positron, the electron's antiparticle) collide. At low energies, the result of the collision is the annihilation of the electron and positron, and the creation of energetic photons: _Electron + _Positron → _Photon + _Photon At high energies, other particles, such as B mesons or the W and Z bosons, can be created. All processes must satisfy a number of conservation laws, including: Conservation of electric charge.
65 nm processThe 65 nm process is an advanced lithographic node used in volume CMOS (MOSFET) semiconductor fabrication. Printed linewidths (i.e. transistor gate lengths) can reach as low as 25 nm on a nominally 65 nm process, while the pitch between two lines may be greater than 130 nm. For comparison, cellular ribosomes are about 20 nm end-to-end. A crystal of bulk silicon has a lattice constant of 0.543 nm, so such transistors are on the order of 100 atoms across. By September 2007, Intel, AMD, IBM, UMC and Chartered were also producing 65 nm chips.
RadiationIn physics, radiation is the emission or transmission of energy in the form of waves or particles through space or through a material medium. This includes: electromagnetic radiation, such as radio waves, microwaves, infrared, visible light, ultraviolet, x-rays, and gamma radiation (γ) particle radiation, such as alpha radiation (α), beta radiation (β), proton radiation and neutron radiation (particles of non-zero rest energy) acoustic radiation, such as ultrasound, sound, and seismic waves (dependent on a physical transmission medium) gravitational radiation, that takes the form of gravitational waves, or ripples in the curvature of spacetime Radiation is often categorized as either ionizing or non-ionizing depending on the energy of the radiated particles.
Gamma rayA gamma ray, also known as gamma radiation (symbol γ or ), is a penetrating form of electromagnetic radiation arising from the radioactive decay of atomic nuclei. It consists of the shortest wavelength electromagnetic waves, typically shorter than those of X-rays. With frequencies above 30 exahertz (3e19Hz), it imparts the highest photon energy. Paul Villard, a French chemist and physicist, discovered gamma radiation in 1900 while studying radiation emitted by radium.
Positron emission tomographyPositron emission tomography (PET) is a functional imaging technique that uses radioactive substances known as radiotracers to visualize and measure changes in metabolic processes, and in other physiological activities including blood flow, regional chemical composition, and absorption. Different tracers are used for various imaging purposes, depending on the target process within the body. For example, -FDG is commonly used to detect cancer, NaF is widely used for detecting bone formation, and oxygen-15 is sometimes used to measure blood flow.
Neutron detectionNeutron detection is the effective detection of neutrons entering a well-positioned detector. There are two key aspects to effective neutron detection: hardware and software. Detection hardware refers to the kind of neutron detector used (the most common today is the scintillation detector) and to the electronics used in the detection setup. Further, the hardware setup also defines key experimental parameters, such as source-detector distance, solid angle and detector shielding.
Bismuth germanateBismuth germanium oxide or bismuth germanate is an inorganic chemical compound of bismuth, germanium and oxygen. Most commonly the term refers to the compound with chemical formula (BGO), with the cubic evlitine crystal structure, used as a scintillator. (The term may also refer to a different compound with formula Bi12GeO20, an electro-optical material with sillenite structure, and .) Bi4Ge3O12 has a cubic crystal structure (a = 1.0513 nm, z = 4, Pearson symbol cI76, space group I3d No. 220) and a density of 7.
CMOSComplementary metal–oxide–semiconductor (CMOS, pronounced "sea-moss", siːmɑːs, -ɒs) is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips (including CMOS BIOS), and other digital logic circuits.
Vacuum tubeA vacuum tube, electron tube, valve (British usage), or tube (North America), is a device that controls electric current flow in a high vacuum between electrodes to which an electric potential difference has been applied. The type known as a thermionic tube or thermionic valve utilizes thermionic emission of electrons from a hot cathode for fundamental electronic functions such as signal amplification and current rectification.
AnnihilationIn particle physics, annihilation is the process that occurs when a subatomic particle collides with its respective antiparticle to produce other particles, such as an electron colliding with a positron to produce two photons. The total energy and momentum of the initial pair are conserved in the process and distributed among a set of other particles in the final state. Antiparticles have exactly opposite additive quantum numbers from particles, so the sums of all quantum numbers of such an original pair are zero.
Smoke detectorA smoke detector is a device that senses smoke, typically as an indicator of fire. Smoke detectors are usually housed in plastic enclosures, typically shaped like a disk about in diameter and thick, but shape and size vary. Smoke can be detected either optically (photoelectric) or by physical process (ionization). Detectors may use one or both sensing methods. Sensitive alarms can be used to detect and deter smoking in banned areas. Smoke detectors in large commercial and industrial buildings are usually connected to a central fire alarm system.
Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
Die shrinkThe term die shrink (sometimes optical shrink or process shrink) refers to the scaling of metal–oxide–semiconductor (MOS) devices. The act of shrinking a die creates a somewhat identical circuit using a more advanced fabrication process, usually involving an advance of lithographic nodes. This reduces overall costs for a chip company, as the absence of major architectural changes to the processor lowers research and development costs while at the same time allowing more processor dies to be manufactured on the same piece of silicon wafer, resulting in less cost per product sold.
