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Die Level Release of Silicon Photonic MEMS

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Niels Quack, Teodoro Graziosi
2016
Conference Papers

Abstract

We demonstrate a die level release process for silicon photonic MEMS structures, that is compatible with dies from a standard silicon photonics foundry process which are only several square millimeters in size.

Official source

https://infoscience.epfl.ch/entities/publication/96216492-3c51-4bd6-a0b0-e6d60bea6123

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