Modification of Thick-film Conductors Used in IP Technology for Reduction of Warpage during Co-firing of LTCC (Low Temperature Co-fired Ceramic) Modules

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Related publications (30)

Inkjet Printing of Complex Soft Machines with Densely Integrated Electrostatic Actuators

Samuel Rosset, Herbert Shea, Samuel Schlatter, Giulio Grasso

A multimaterial inkjet printing method for integrated soft multifunctional machines is reported, combining dense arrays of electrostatic actuators, multilayer electrical routing, and complex networks of microfluidic channels in one printing process. Most a ...

2020

Gallium-Based Thin Films for Wearable Sensors and Electronic Skins

Laurent Mirko Dejace

Integrated wearable electronics capable of providing biophysical information on complex and dynamic systems have attracted high interest in diverse fields such as healthcare, gaming and robotics. Wearable sensors can create artificial, electronic skins wit ...

EPFL2020

Printed flexible and transparent electronics: enhancing low-temperature processed metal oxides with 0D and 1D nanomaterials

Vivek Subramanian

Metal oxides have broad multifunctionality and important applications to energy, sensing, and information display. Printed electronics have recently adopted metal oxides to push the limits of performance and stability for flexible thin film systems. Howeve ...

IOP PUBLISHING LTD2019

Implementation of Functional Microfluidic Dispensing Tools Enabling Enhanced Control in Extrusion Bioprinting

Ludovic Serex

Inspired from additive manufacturing's success, the structuring of biocompatible materials through bioprinting has become a growing field of research in the past fifteen years. It opened the door to a plethora of applications ranging from the fabrication o ...

EPFL2019

Gravure printed Ag/conductive polymer electrodes and simulation of their electrical properties

Frank Nüesch, René Uwe Schneider, Jakob Heier

In this paper, some practical issues related to the manufacturing, and design criteria related to the application in devices of a hybrid silver grid/poly (3,4-ethylenedioxythiophene) semi-transparent electrode are discussed. The electrodes are fabricated b ...

SPRINGER LONDON LTD2019

Low-Temperature Screen-Printed Metallization for the Scale-Up of Two-Terminal Perovskite-Silicon Tandems

Christophe Ballif, Nicolas Badel, Antonin Faes, Jacques Levrat, Laura Ding, Sylvain Nicolay, Gabriel Christmann, Soo-Jin Moon, Arnaud Walter, Adriana Paracchino, Matthieu Despeisse, Bertrand Yves Paul Paviet-Salomon

Tandem photovoltaic devices based on perovskite and crystalline silicon (PK/c-Si) absorbers have the potential to push commercial silicon single junction devices beyond their current efficiency limit. However, their scale-up to industrially relevant sizes ...

AMER CHEMICAL SOC2019

Liquid electromigration in gallium-based biphasic thin films

Stéphanie Lacour, Hadrien Olivier Michaud

Liquid metals have recently gained interest as a material of choice for soft and stretchable electronic circuits, thanks to their virtually infinite mechanical failure strain and high electrical conductivity. Gallium-based thin films are obtained by deposi ...

2019

Thin Hydrogel-Elastomer Multilayer Encapsulation for Soft Electronics

Stéphanie Lacour, Aaron Powers Gerratt, Jennifer Mary Adrienne Alice Macron

In the exciting race to design and engineer biointegrated and body-like electronic systems, many efforts concentrate on the integration of hydrogels in electronic assemblies. The versatility of hydrogels chemistry combined with their tissue-mimicking prope ...

Wiley2019

Effect of annealing temperature on the performance of printable carbon electrodes for perovskite solar cells

Mohammad Khaja Nazeeruddin, Iwan Zimmermann, Zubair Ahmad

Perovskite solar cells (PSCs) with mesoporous TiO2 electron transport layers have reached > 22% efficiency at laboratory scale ( < 1 cm(2)), however, these layers are fabricated using spin-coating, which is not conducive to large-scale or high throughput f ...

ELSEVIER SCIENCE BV2019

Method for manufacturing hybrid soft-rigid electronic devices

Florian Dylan Fallegger, Hadrien Olivier Michaud, Arthur Edouard Hirsch, Aaron Powers Gerratt

A method for manufacturing a hybrid soft-rigid electromechanical device comprising the steps of i) placing electronic components on a temporary substrate; ii) encapsulating said electronic components within a soft curable material and curing said soft cura ...

2019

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