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Publication

Modification of Thick-film Conductors Used in IP Technology for Reduction of Warpage during Co-firing of LTCC (Low Temperature Co-fired Ceramic) Modules

Thomas Maeder, Peter Ryser, Hansu Birol
2006
Journal Articles

Abstract

LTCC technology offers low temperature firing (

Official source

https://infoscience.epfl.ch/entities/publication/8e4e02a1-aa9d-4d2b-943c-a56e1afa2ba5

About this result

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Thomas Maeder, Peter Ryser, Hansu Birol
2006
Journal Articles

Abstract

LTCC technology offers low temperature firing (

Official source

https://infoscience.epfl.ch/entities/publication/8e4e02a1-aa9d-4d2b-943c-a56e1afa2ba5

About this result

Related concepts (18)

Flexible electronics

Flexible electronics, also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester film. Additionally, flex circuits can be screen printed silver circuits on polyester. Flexible electronic assemblies may be manufactured using identical components used for rigid printed circuit boards, allowing the board to conform to a desired shape, or to flex during its use.

Printed circuit board

A printed circuit board (PCB), also called printed wiring board (PWB), is a medium used to connect or "wire" components to one another in a circuit. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.

Screen printing

Screen printing is a printing technique where a mesh is used to transfer ink (or dye) onto a substrate, except in areas made impermeable to the ink by a blocking stencil. A blade or squeegee is moved across the screen to fill the open mesh apertures with ink, and a reverse stroke then causes the screen to touch the substrate momentarily along a line of contact. This causes the ink to wet the substrate and be pulled out of the mesh apertures as the screen springs back after the blade has passed.

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Modification of Thick-film Conductors Used in IP Technology for Reduction of Warpage during Co-firing of LTCC (Low Temperature Co-fired Ceramic) Modules

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