Ultra Low-Power MEMS-based Radio for Wireless Sensor Networks

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500 MHz high resolution proximity sensors with fully integrated digital counter

Giovanni Boero, Nergiz Sahin Solmaz, Reza Farsi

We report on the design and characterization of two inductive proximity sensors based on LC oscillators operating at 500 MHz. The distance from the target is obtained by measuring the oscillation frequency variation. Both sensors contain an off-chip LC res ...

ELSEVIER SCI LTD2023

WINC: A Wireless IoT Network for Multi-Noise Source Cancellation

Haitham Al Hassanieh, Junfeng Guan

This paper introduces Wireless IoT-based Noise Cancellation (WINC) which defines a framework for leveraging a wireless network of IoT microphones to enhance active noise cancellation in noise-canceling headphones. The IoT microphones forward ambient noise ...

Assoc Computing Machinery2023

A Front-End CMOS Interface Circuit With High Voltage Charge Pump and Oscillator for Capacitive Micromachined Ultrasonic Transducers

Sandro Carrara, Gian Luca Barbruni, Yihe Zhao

Label-free biosensors, combined with miniaturized micro-electromechanical sensory platforms, offer an attractive solution for real-time and facile monitoring of biomolecules due to their high sensitivity and selectivity without the need for specifically la ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Ultra-Low Power Short-Range 60-GHz FMCW Radar Front-End

Sammy Cerida Rengifo

The millimeter wave (mmWave) frequency band is becoming very interesting over the past years because it provides the opportunity to operate using large bandwidths which are not available at lower frequencies. This enables new communication standards suppor ...

EPFL2023

Optimal digital filter selection for remote photoplethysmography (rPPG) signal conditioning

Ata Jedari Golparvar

Remote photoplethysmography (rPPG) using camera-based imaging has shown excellent potential recently in vital signs monitoring due to its contactless nature. However, the optimum filter selection for pre-processing rPPG data in signal conditioning is still ...

IOP Publishing Ltd2023

Complex-Valued-Autoencoder for Structural Health Monitoring with Frequency Modulated Continuous Wave Radar

Olga Fink, Gaëtan Michel Frusque

The occurrence of manufacturing defects in wind turbine blade (WTB) production can result in significant increases in operation and maintenance costs of WTBs, reduce capacity factors of wind farms, and occasionally lead to severe and disastrous consequence ...

Research Publishing2023

Self-powered transformer intelligent wireless temperature monitoring system based on an ultra-low acceleration piezoelectric vibration energy harvester

Xin Chen

The wireless sensor nodes used for monitoring the condition of grid equipment always be powered by disposable batteries. However, it introduces disadvantages, such as inconvenient replacement, short lifespan, and envi-ronmental pollution, significantly imp ...

Elsevier2023

Toward Band n78 Shear Bulk Acoustic Resonators Using Crystalline Y-Cut Lithium Niobate Films With Spurious Suppression

Luis Guillermo Villanueva Torrijo, Soumya Yandrapalli

This work presents the study of suspended Y-cut Lithium Niobate shear bulk acoustic resonators for wide band filter applications in the frequency range of 3.5-4.5GHz. The resonators consist of a Lithium Niobate film with Aluminum top interdigitated electro ...

Institute of Electrical and Electronics Engineers2023

Front-End Circuits for Radiation-Hard Monolithic CMOS Sensors targeting High-Energy Physics Applications

Francesco Piro

Monolithic pixel sensors integrate the sensor matrix and readout in the same silicon die, and therefore present several advantages over the more largely used hybrid detectors in high-energy physics. They offer an easier detector assembly, lower cost, lower ...

EPFL2023

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023