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Publication

Diffusion-barrier coating for protection of moisture and oxygen sensitive devices

Jan-Anders Edvin Maansson, Yves Leterrier, Bandeep Singh
2008
Patents

Abstract

Barrier film for encapsulation of oxygen and moisture sensitive devices comprising a base polymer substrate and applied onto the base substrate, a barrier layer comprising an inorganic coating deposited by a vapour deposition method, characterised in that the deposited barrier coating is further coated with a healing layer consisting of a crosslinked organopolysiloxane, which is covalently bound to the inorganic coating.

Official source

https://infoscience.epfl.ch/entities/publication/894bb046-e621-4f1d-9479-cfdfd76be321

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Jan-Anders Edvin Maansson, Yves Leterrier, Bandeep Singh
2008
Patents

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/894bb046-e621-4f1d-9479-cfdfd76be321

About this result

Related concepts (17)

Vacuum deposition

Vacuum deposition , also known as vacuum coating or thin-film deposition, is a group of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure (i.e., vacuum). The deposited layers can range from a thickness of one atom up to millimeters, forming freestanding structures. Multiple layers of different materials can be used, for example to form optical coatings.

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

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Diffusion-barrier coating for protection of moisture and oxygen sensitive devices

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