Heat transferHeat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy (heat) between physical systems. Heat transfer is classified into various mechanisms, such as thermal conduction, thermal convection, thermal radiation, and transfer of energy by phase changes. Engineers also consider the transfer of mass of differing chemical species (mass transfer in the form of advection), either cold or hot, to achieve heat transfer.
HeatIn thermodynamics, heat is the thermal energy transferred between systems due to a temperature difference. In colloquial use, heat sometimes refers to thermal energy itself. An example of formal vs. informal usage may be obtained from the right-hand photo, in which the metal bar is "conducting heat" from its hot end to its cold end, but if the metal bar is considered a thermodynamic system, then the energy flowing within the metal bar is called internal energy, not heat.
Heat transfer coefficientIn thermodynamics, the heat transfer coefficient or film coefficient, or film effectiveness, is the proportionality constant between the heat flux and the thermodynamic driving force for the flow of heat (i.e., the temperature difference, ΔT ). It is used in calculating the heat transfer, typically by convection or phase transition between a fluid and a solid. The heat transfer coefficient has SI units in watts per square meter per kelvin (W/m2/K).
Thermal radiationThermal radiation is electromagnetic radiation generated by the thermal motion of particles in matter. Thermal radiation is generated when heat from the movement of charges in the material (electrons and protons in common forms of matter) is converted to electromagnetic radiation. All matter with a temperature greater than absolute zero emits thermal radiation. At room temperature, most of the emission is in the infrared (IR) spectrum. Particle motion results in charge-acceleration or dipole oscillation which produces electromagnetic radiation.
Convection (heat transfer)Convection (or convective heat transfer) is the transfer of heat from one place to another due to the movement of fluid. Although often discussed as a distinct method of heat transfer, convective heat transfer involves the combined processes of conduction (heat diffusion) and advection (heat transfer by bulk fluid flow). Convection is usually the dominant form of heat transfer in liquids and gases. Note that this definition of convection is only applicable in Heat transfer and thermodynamic contexts.
Thermal energy storageThermal energy storage (TES) is achieved with widely different technologies. Depending on the specific technology, it allows excess thermal energy to be stored and used hours, days, months later, at scales ranging from the individual process, building, multiuser-building, district, town, or region. Usage examples are the balancing of energy demand between daytime and nighttime, storing summer heat for winter heating, or winter cold for summer air conditioning (Seasonal thermal energy storage).
Heat sinkA heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules.
Thermal conductionConduction is the process by which heat is transferred from the hotter end to the colder end of an object. The ability of the object to conduct heat is known as its thermal conductivity, and is denoted k. Heat spontaneously flows along a temperature gradient (i.e. from a hotter body to a colder body). For example, heat is conducted from the hotplate of an electric stove to the bottom of a saucepan in contact with it.
Thermal management (electronics)All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.
Heat pipeA heat pipe is a heat-transfer device that employs phase transition to transfer heat between two solid interfaces. At the hot interface of a heat pipe, a volatile liquid in contact with a thermally conductive solid surface turns into a vapor by absorbing heat from that surface. The vapor then travels along the heat pipe to the cold interface and condenses back into a liquid, releasing the latent heat. The liquid then returns to the hot interface through capillary action, centrifugal force, or gravity and the cycle repeats.
Heat exchangerA heat exchanger is a system used to transfer heat between a source and a working fluid. Heat exchangers are used in both cooling and heating processes. The fluids may be separated by a solid wall to prevent mixing or they may be in direct contact. They are widely used in space heating, refrigeration, air conditioning, power stations, chemical plants, petrochemical plants, petroleum refineries, natural-gas processing, and sewage treatment.
TurbomachineryTurbomachinery, in mechanical engineering, describes machines that transfer energy between a rotor and a fluid, including both turbines and compressors. While a turbine transfers energy from a fluid to a rotor, a compressor transfers energy from a rotor to a fluid. These two types of machines are governed by the same basic relationships including Newton's second Law of Motion and Euler's pump and turbine equation for compressible fluids.
Thermal design powerThe thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called scenario design power (SDP) for some Ivy Bridge Y-series processors.
Thermal resistanceThermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. (Absolute) thermal resistance R in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. Specific thermal resistance or thermal resistivity Rλ in kelvin–metres per watt (K⋅m/W), is a material constant.
Computer coolingComputer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, and hard disk drives. Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling.
Thermal massIn building design, thermal mass is a property of the mass of a building that enables it to store heat and provide inertia against temperature fluctuations. It is sometimes known as the thermal flywheel effect. The thermal mass of heavy structural elements can be designed to work alongside a construction's lighter thermal resistance components to create energy efficient buildings.
Heat recovery ventilationHeat recovery ventilation (HRV), also known as mechanical ventilation heat recovery (MVHR), is an energy recovery ventilation system that operates between two air sources at different temperatures. It's a method that is used to reduce the heating and cooling demands of buildings. By recovering the residual heat in the exhaust gas, the fresh air introduced into the air conditioning system is preheated (or pre-cooled), and the fresh air's enthalpy is reduced before it enters the room, or the air cooler of the air conditioning unit performs heat and moisture treatment.
Plate tectonicsPlate tectonics (from the tectonicus, from the τεκτονικός) is the scientific theory that Earth's lithosphere comprises a number of large tectonic plates which have been slowly moving since about 3.4 billion years ago. The model builds on the concept of continental drift, an idea developed during the first decades of the 20th century. Plate tectonics came to be accepted by geoscientists after seafloor spreading was validated in the mid-to-late 1960s.
