Publication

Wire-shaped magnetic mutilayers for 'current perpendicular to plane' magnetoresistance measurements

Jean-Philippe Ansermet
1995
Journal Articles

Abstract

Electrodeposition of magnetic multilayers was achieved in the cylindrical pores of a nuclear track-etched polycarbonate membrane. An assembly of wires with an average diameter of 80 nm and a length of 6 μm was obtained. Multilayers in these wires were grown by pulsed deposition of (Co, Ni) and Cu. The high aspect ratio of the sample allowed us to measure the magnetoresistance with the current perpendicular to the planes. Magnetoresistance ratios higher than 20% at ambient temperature are reported. © 1995.

Official source

https://infoscience.epfl.ch/entities/publication/818d4329-d143-4371-bac5-b91a7310a79a

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Jean-Philippe Ansermet
1995
Journal Articles

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/818d4329-d143-4371-bac5-b91a7310a79a

About this result

Related concepts (20)

Pulsed laser deposition

Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.

Tunnel magnetoresistance

Tunnel magnetoresistance (TMR) is a magnetoresistive effect that occurs in a magnetic tunnel junction (MTJ), which is a component consisting of two ferromagnets separated by a thin insulator. If the insulating layer is thin enough (typically a few nanometres), electrons can tunnel from one ferromagnet into the other. Since this process is forbidden in classical physics, the tunnel magnetoresistance is a strictly quantum mechanical phenomenon. Magnetic tunnel junctions are manufactured in thin film technology.

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

Related publications (4)

Wire-shaped magnetic mutilayers for 'current perpendicular to plane' magnetoresistance measurements

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