Thermal management (electronics)All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.
Computer coolingComputer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, and hard disk drives. Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling.
Water coolingWater cooling is a method of heat removal from components and industrial equipment. Evaporative cooling using water is often more efficient than air cooling. Water is inexpensive and non-toxic; however, it can contain impurities and cause corrosion. Water cooling is commonly used for cooling automobile internal combustion engines and power stations. Water coolers utilising convective heat transfer are used inside high-end personal computers to lower the temperature of CPUs and other components.
Cooling towerA cooling tower is a device that rejects waste heat to the atmosphere through the cooling of a coolant stream, usually a water stream, to a lower temperature. Cooling towers may either use the evaporation of water to remove process heat and cool the working fluid to near the wet-bulb air temperature or, in the case of dry cooling towers, rely solely on air to cool the working fluid to near the dry-bulb air temperature using radiators.
Radiator (engine cooling)Radiators are heat exchangers used for cooling internal combustion engines, mainly in automobiles but also in piston-engined aircraft, railway locomotives, motorcycles, stationary generating plant or any similar use of such an engine. Internal combustion engines are often cooled by circulating a liquid called engine coolant through the engine block, and cylinder head where it is heated, then through a radiator where it loses heat to the atmosphere, and then returned to the engine.
Radiative coolingIn the study of heat transfer, radiative cooling is the process by which a body loses heat by thermal radiation. As Planck's law describes, every physical body spontaneously and continuously emits electromagnetic radiation. Radiative cooling has been applied in various contexts throughout human history, including ice making in India and Iran, heat shields for spacecraft, and in architecture. In 2014, a scientific breakthrough in the use of photonic metamaterials made daytime radiative cooling possible.
System on a chipA system on a chip or system-on-chip (SoC ,ˈɛsoʊsiː; pl. SoCs ,ˈɛsoʊsiːz) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip.
CoolingCooling is removal of heat, usually resulting in a lower temperature and/or phase change. Temperature lowering achieved by any other means may also be called cooling. The transfer of thermal energy may occur via thermal radiation, heat conduction or convection. Examples can be as simple as reducing temperature of a coffee. Coolant Cooling towers, as used in large industrial plants and power stations Daytime passive radiative cooler Evaporative cooler Heat exchanger Heat pipe Heat sink HVAC (Heating, Ventila
Deep water source coolingDeep water source cooling (DWSC) or deep water air cooling is a form of air cooling for process and comfort space cooling which uses a large body of naturally cold water as a heat sink. It uses water at 4 to 10 degrees Celsius drawn from deep areas within lakes, oceans, aquifers or rivers, which is pumped through the one side of a heat exchanger. On the other side of the heat exchanger, cooled water is produced. Water is most dense at at standard atmospheric pressure. Thus as water cools below 3.
Passive daytime radiative coolingPassive daytime radiative cooling (PDRC) is a renewable cooling method proposed as a solution to global warming of enhancing terrestrial heat flow to outer space through the installation of thermally-emissive surfaces on Earth that require zero energy consumption or pollution. Because all materials in nature absorb more heat during the day than at night, PDRC surfaces are designed to be high in solar reflectance (to minimize heat gain) and strong in longwave infrared (LWIR) thermal radiation heat transfer through the atmosphere's infrared window (8–13 μm) to cool temperatures during the daytime.
Passive coolingPassive cooling is a building design approach that focuses on heat gain control and heat dissipation in a building in order to improve the indoor thermal comfort with low or no energy consumption. This approach works either by preventing heat from entering the interior (heat gain prevention) or by removing heat from the building (natural cooling). Natural cooling utilizes on-site energy, available from the natural environment, combined with the architectural design of building components (e.g.
Thermal resistanceThermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. (Absolute) thermal resistance R in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. Specific thermal resistance or thermal resistivity Rλ in kelvin–metres per watt (K⋅m/W), is a material constant.
Internal combustion engine coolingInternal combustion engine cooling uses either air or liquid to remove the waste heat from an internal combustion engine. For small or special purpose engines, cooling using air from the atmosphere makes for a lightweight and relatively simple system. Watercraft can use water directly from the surrounding environment to cool their engines. For water-cooled engines on aircraft and surface vehicles, waste heat is transferred from a closed loop of water pumped through the engine to the surrounding atmosphere by a radiator.
Thermal insulationThermal insulation is the reduction of heat transfer (i.e., the transfer of thermal energy between objects of differing temperature) between objects in thermal contact or in range of radiative influence. Thermal insulation can be achieved with specially engineered methods or processes, as well as with suitable object shapes and materials. Heat flow is an inevitable consequence of contact between objects of different temperature.
Thermal contact conductanceIn physics, thermal contact conductance is the study of heat conduction between solid or liquid bodies in thermal contact. The thermal contact conductance coefficient, , is a property indicating the thermal conductivity, or ability to conduct heat, between two bodies in contact. The inverse of this property is termed thermal contact resistance. When two solid bodies come in contact, such as A and B in Figure 1, heat flows from the hotter body to the colder body.
Benchmark (computing)In computing, a benchmark is the act of running a computer program, a set of programs, or other operations, in order to assess the relative performance of an object, normally by running a number of standard tests and trials against it. The term benchmark is also commonly utilized for the purposes of elaborately designed benchmarking programs themselves. Benchmarking is usually associated with assessing performance characteristics of computer hardware, for example, the floating point operation performance of a CPU, but there are circumstances when the technique is also applicable to software.
Heat pipeA heat pipe is a heat-transfer device that employs phase transition to transfer heat between two solid interfaces. At the hot interface of a heat pipe, a volatile liquid in contact with a thermally conductive solid surface turns into a vapor by absorbing heat from that surface. The vapor then travels along the heat pipe to the cold interface and condenses back into a liquid, releasing the latent heat. The liquid then returns to the hot interface through capillary action, centrifugal force, or gravity and the cycle repeats.
Vision processing unitA vision processing unit (VPU) is (as of 2023) an emerging class of microprocessor; it is a specific type of AI accelerator, designed to accelerate machine vision tasks. Vision processing units are distinct from video processing units (which are specialised for video encoding and decoding) in their suitability for running machine vision algorithms such as CNN (convolutional neural networks), SIFT (scale-invariant feature transform) and similar.
Scratchpad memoryScratchpad memory (SPM), also known as scratchpad, scratchpad RAM or local store in computer terminology, is an internal memory, usually high-speed, used for temporary storage of calculations, data, and other work in progress. In reference to a microprocessor (or CPU), scratchpad refers to a special high-speed memory used to hold small items of data for rapid retrieval. It is similar to the usage and size of a scratchpad in life: a pad of paper for preliminary notes or sketches or writings, etc.
Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
