Publications related to Hermetic package for optical MEMS

Related publications (30)

Light Emission and Conductance Fluctuations in Electrically Driven and Plasmonically Enhanced Molecular Junctions

Zhiyuan Xie, Christophe Marcel Georges Galland, Wen Chen, Sakthi Priya Amirtharaj, Konstantin Malchow

Electrically connected and plasmonically enhanced molecular junctions combine the optical functionalities of high field confinement and enhancement (cavity function), and of high radiative efficiency (antenna function) with the electrical functionalities o ...

Amer Chemical Soc2024

Pyroresistive response of percolating conductive polymer composites

Claudio Grimaldi

The pyroresistive response of conductive polymer composites (CPCs) has attracted much interest because of its potential applications in many electronic devices requiring a significant responsiveness to changes in external physical parameters such as temper ...

Amer Physical Soc2024

Integrated silicon photonic MEMS

Niels Quack, Alain Yuji Takabayashi, Hamed Sattari

Silicon photonics has emerged as a mature technology that is expected to play a key role in critical emerging applications, including very high data rate optical communications, distance sensing for autonomous vehicles, photonic-accelerated computing, and ...

SPRINGERNATURE2023

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

Semiconductor-based device architectures in multimaterial fibers

William Nicolas Duncan Esposito

Semiconductor materials have given rise to today's digital technology and consumer electronics. Widespread adoption is closely linked to the ability to process and integrate them in devices at scale. Where flexibility and large surfaces are required, such ...

EPFL2023

Digital manufacturing of personalised footwear with embedded sensors

Danick Briand, Rubaiyet Iftekharul Haque, Jaemin Kim, Ryan Mitchell van Dommelen

The strong clinical demand for more accurate and personalized health monitoring technologies has called for the development of additively manufactured wearable devices. While the materials palette for additive manufacturing continues to expand, the integra ...

Nature Research2023

System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Joshua Alexander Harrison Klein, Rafael Medina Morillas

Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...

2023

Resonators with tailored optical path by cascaded-mode conversions

Ileana-Cristina Benea-Chelmus

Optical resonators enable the generation, manipulation, and storage of electromagnetic waves. The physics underlying their operation is determined by the interference of electromagnetic waves, giving rise to the resonance spectrum. This mechanism causes th ...

Nature Portfolio2023

AC loss and electrical resistance of the RW3 diffusion-bonded joint

Vincenzo D'Auria

For the European DEMO fusion reactor, several options of the Toroidal Field (TF) coil design were proposed. The winding of the TF coil option 1 is based on React&Wind (RW), Nb3Sn, graded conductors in order to optimize the amount of superconductor accordin ...

2023

Solvent-Free Synthesis and Processing of Conductive Elastomer Composites for Green Dielectric Elastomer Transducers

Frank Nüesch

Stretchable electrodes are more suitable for dielectric elastomer transducers (DET) the closer the mechanical characteristics of the electrodes and elastomer are. Here, a solvent-free synthesis and processing of conductive composites with excellent electri ...

WILEY-V C H VERLAG GMBH2022

Development of stencil lithography for stretchable interconnects

Yi-Chiang Sun

The growing needs for human healthcare have driven the development of wearable devices for monitoring the health status of an individual. Polymers represent a promising platform for such devices due to their ability to form an intimate contact between soft ...

EPFL2022

Diffusion-Bonding Between Strands and Modeling of Splices of Nb3Sn Rutherford Cables

Pierluigi Bruzzone, Kamil Sedlák, Nikolay Bykovskiy

Particle accelerators foresee the use of Nb3Sn in the next generation of dipole magnets. A common design strategy is to grade the coil, i.e., to optimize the quantity of superconductor in the turns with respect to the magnetic field intensity. As a consequ ...

IEEE Institute of Electrical and Electronics Engineers2022

Ultra low quantum decoherence nano-optomechanical systems

Mohammadjafar Bereyhi

Thermal motion of a room-temperature mechanical resonator typically dominates the quantum backaction of its position measurement. This is a longstanding barrier for exploring cavity optomechanics at room temperature. In order to enter the quantum regime of ...

EPFL2022

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Alain Yuji Takabayashi, Hamed Sattari

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Soft functional fibers for mechanical sensing and actuation

Andreas Leber

The measurement and generation of mechanical deformations is a key functionality in health monitoring, human-machine interaction, and soft robotics. However, current methods typically rely on small and hard transducers, which result in poor performance, cu ...

EPFL2021

Electrical transport properties of Ru1-xTixO2 films deposited by magnetron sputtering technique

Silviu Cosmin Sandu, Rosendo Sanjines

The optical and electrical properties of Ru1-xTixO2 (0

PERGAMON-ELSEVIER SCIENCE LTD2021

A cryogenic electro-optic interconnect for superconducting devices

Tobias Kippenberg, Anton Lukashchuk, Nathan Rafaël Bernier, Liu Qiu, Itay Shomroni, Amir Youssefi, Philipp Johann Uhrich

A major challenge to the scalability of cryogenic computing platforms is the heat load associated with the growing number of electrical cable connections between the superconducting circuitry and the room-temperature environment. Compared with electrical c ...

2021

2D Material Based Inks For Room Temperature Printed Electronics

Sina Abdolhosseinzadeh

Functional printing is a versatile mass production method that has gained considerable scientific and industrial attention in the past few years. A wide range of electronics from passive circuit components (e.g., resistors and interconnects) to high-perfor ...

EPFL2021

Elongated microstructured capacitive sensor

Véronique Michaud, Fabien Sorin, Dang Tùng Nguyen, Baris Çaglar, Chaoqun Dong, William Nicolas Duncan Esposito

The present invention concerns an elongated capacitive sensor (1) for fluid monitoring. The sensor (1) comprising: a fibre support (5) made of a dielectric material or dielectric composite material; and a first electrode (7, 9) and a second electrode (7, 9 ...

2021