Liquid-mirror telescopeLiquid-mirror telescopes are telescopes with mirrors made with a reflective liquid. The most common liquid used is mercury, but other liquids will work as well (for example, low-melting point alloys of gallium). The liquid and its container are rotated at a constant speed around a vertical axis, which causes the surface of the liquid to assume a paraboloidal shape. This parabolic reflector can serve as the primary mirror of a reflecting telescope.
Massive compact halo objectA massive astrophysical compact halo object (MACHO) is a kind of astronomical body that might explain the apparent presence of dark matter in galaxy halos. A MACHO is a body that emits little or no radiation and drifts through interstellar space unassociated with any planetary system (and may or may not be composed of normal baryonic matter). Since MACHOs are not luminous, they are hard to detect. MACHO candidates include black holes or neutron stars as well as brown dwarfs and unassociated planets.
PhotonicsPhotonics is a branch of optics that involves the application of generation, detection, and manipulation of light in form of photons through emission, transmission, modulation, signal processing, switching, amplification, and sensing. Photonics is closely related to quantum electronics, where quantum electronics deals with the theoretical part of it while photonics deal with its engineering applications. Though covering all light's technical applications over the whole spectrum, most photonic applications are in the range of visible and near-infrared light.
Optical flatAn optical flat is an optical-grade piece of glass lapped and polished to be extremely flat on one or both sides, usually within a few tens of nanometres (billionths of a metre). They are used with a monochromatic light to determine the flatness (surface accuracy) of other surfaces, whether optical, metallic, ceramic, or otherwise, by interference. When an optical flat is placed on another surface and illuminated, the light waves reflect off both the bottom surface of the flat and the surface it is resting on.
Group selectionGroup selection is a proposed mechanism of evolution in which natural selection acts at the level of the group, instead of at the level of the individual or gene. Early authors such as V. C. Wynne-Edwards and Konrad Lorenz argued that the behavior of animals could affect their survival and reproduction as groups, speaking for instance of actions for the good of the species. In the 1930s, R.A. Fisher and J.B.S.
Astronomical objectAn astronomical object, celestial object, stellar object or heavenly body is a naturally occurring physical entity, association, or structure that exists within the observable universe. In astronomy, the terms object and body are often used interchangeably. However, an astronomical body or celestial body is a single, tightly bound, contiguous entity, while an astronomical or celestial object is a complex, less cohesively bound structure, which may consist of multiple bodies or even other objects with substructures.
MEMSMEMS (Microelectromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2.
Kin selectionKin selection is a process whereby natural selection favours a trait due to its positive effects on the reproductive success of an organism's relatives, even when at a cost to the organism's own survival and reproduction. Kin selection can lead to the evolution of altruistic behaviour. Kin selection is related to the concept of inclusive fitness, which combines the number of offspring produced with the number an individual can ensure the production of by supporting others (weighted by the relatedness between individuals).
Wafer (electronics)In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning.
Electroactive polymerAn electroactive polymer (EAP) is a polymer that exhibits a change in size or shape when stimulated by an electric field. The most common applications of this type of material are in actuators and sensors. A typical characteristic property of an EAP is that they will undergo a large amount of deformation while sustaining large forces. The majority of historic actuators are made of ceramic piezoelectric materials. While these materials are able to withstand large forces, they commonly will only deform a fraction of a percent.
Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
