Physical vapor depositionPhysical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.
Electric currentAn electric current is a flow of charged particles, such as electrons or ions, moving through an electrical conductor or space. It is defined as the net rate of flow of electric charge through a surface. The moving particles are called charge carriers, which may be one of several types of particles, depending on the conductor. In electric circuits the charge carriers are often electrons moving through a wire. In semiconductors they can be electrons or holes.
Pulsed laser depositionPulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.
Egyptian fractionAn Egyptian fraction is a finite sum of distinct unit fractions, such as That is, each fraction in the expression has a numerator equal to 1 and a denominator that is a positive integer, and all the denominators differ from each other. The value of an expression of this type is a positive rational number ; for instance the Egyptian fraction above sums to . Every positive rational number can be represented by an Egyptian fraction.
Chemical vapor depositionChemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.
Irreducible fractionAn irreducible fraction (or fraction in lowest terms, simplest form or reduced fraction) is a fraction in which the numerator and denominator are integers that have no other common divisors than 1 (and −1, when negative numbers are considered). In other words, a fraction a/b is irreducible if and only if a and b are coprime, that is, if a and b have a greatest common divisor of 1. In higher mathematics, "irreducible fraction" may also refer to rational fractions such that the numerator and the denominator are coprime polynomials.
Low-power electronicsLow-power electronics are electronics, such as notebook processors, that have been designed to use less electric power than usual, often at some expense. In the case of notebook processors, this expense is processing power; notebook processors usually consume less power than their desktop counterparts, at the expense of lower processing power. watch The earliest attempts to reduce the amount of power required by an electronic device were related to the development of the wristwatch.
Sputter depositionSputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K).
Fusion powerFusion power is a proposed form of power generation that would generate electricity by using heat from nuclear fusion reactions. In a fusion process, two lighter atomic nuclei combine to form a heavier nucleus, while releasing energy. Devices designed to harness this energy are known as fusion reactors. Research into fusion reactors began in the 1940s, but as of 2023, no device has reached net power. Fusion processes require fuel and a confined environment with sufficient temperature, pressure, and confinement time to create a plasma in which fusion can occur.
Lockheed Martin Compact Fusion ReactorThe Lockheed Martin Compact Fusion Reactor (CFR) is a fusion power project at Lockheed Martin’s Skunk Works. Its high-beta configuration, which implies that the ratio of plasma pressure to magnetic pressure is greater than or equal to 1 (compared to tokamak designs' 0.05), allows a compact design and expedited development. The project was active between 2010 and 2019, after that date there have been no updates and it appears the division has shut down.
Electrical reactanceIn electrical circuits, reactance is the opposition presented to alternating current by inductance and capacitance. Along with resistance, it is one of two elements of impedance; however, while both elements involve transfer of electrical energy, no dissipation of electrical energy as heat occurs in reactance; instead, the reactance stores energy until a quarter-cycle later when the energy is returned to the circuit. Greater reactance gives smaller current for the same applied voltage.
Electron-beam physical vapor depositionElectron-beam physical vapor deposition, or EBPVD, is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a charged tungsten filament under high vacuum. The electron beam causes atoms from the target to transform into the gaseous phase. These atoms then precipitate into solid form, coating everything in the vacuum chamber (within line of sight) with a thin layer of the anode material.
