Publication

Mechanism of substrate charging after plasma processing

Christoph Hollenstein, Alan Howling, Laurent Fabien Hubert Sansonnens
2001
Conference Papers

Abstract

An electrostatic charge can be left on an insulating substrate after RF plasma processing, even though the plasma and surfaces are globally neutral. High voltages and breakdown can then occur when the substrate is manipulated. If the substrate is not a perfect insulator, charge appears on its back face where there is no contact with the plasma. In this case, the substrate sticks electrostatically to the electrode, and partial discharging can occur when it is lifted. Analysis of in situ charge measurements reveals the mechanism responsible for the charging, which is analogous to electrostatic chucking of the glass to the electrode when exposed to plasma.

Official source

https://infoscience.epfl.ch/entities/publication/635282bd-1042-4e16-b43d-7f8d738c7b25

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Christoph Hollenstein, Alan Howling, Laurent Fabien Hubert Sansonnens
2001
Conference Papers

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/635282bd-1042-4e16-b43d-7f8d738c7b25

About this result

Related concepts (32)

Plasma (physics)

Plasma () is one of four fundamental states of matter, characterized by the presence of a significant portion of charged particles in any combination of ions or electrons. It is the most abundant form of ordinary matter in the universe, being mostly associated with stars, including the Sun. Extending to the rarefied intracluster medium and possibly to intergalactic regions, plasma can be artificially generated by heating a neutral gas or subjecting it to a strong electromagnetic field.

Partial discharge

In electrical engineering, partial discharge (PD) is a localized dielectric breakdown (DB) (which does not completely bridge the space between the two conductors) of a small portion of a solid or fluid electrical insulation (EI) system under high voltage (HV) stress. While a corona discharge (CD) is usually revealed by a relatively steady glow or brush discharge (BD) in air, partial discharges within solid insulation system are not visible. PD can occur in a gaseous, liquid, or solid insulating medium.

Plasma etching

Plasma etching is a form of plasma processing used to fabricate integrated circuits. It involves a high-speed stream of glow discharge (plasma) of an appropriate gas mixture being shot (in pulses) at a sample. The plasma source, known as etch species, can be either charged (ions) or neutral (atoms and radicals). During the process, the plasma generates volatile etch products at room temperature from the chemical reactions between the elements of the material etched and the reactive species generated by the plasma.

Related publications (1)

Mechanism of substrate charging after plasma processing

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