Publication

Preparation of YBCO thin films by a four ion beam co-deposition system

Davor Pavuna
1989
Journal Articles

Abstract

We present preliminary results for thin films grown with a recently commissioned ion beam codeposition system designed for in situ growth and etching of YBCO films. The apparatus consists of a high-vacuum chamber (10-7 Torr) equipped with four Kaufmann ion beam sources. Three of the sources are directed at targets for ion beam sputter deposition of materials; the fourth ion source is directed at the substrate for substrate precleaning, oxygen ion beam assisted deposition and ion beam etching. We have determined individual sputter deposition rates from Y2O3, BaF2 and copper targets as a function of ion beam currents on unheated substrates in argon background, normal background, oxygen background, and oxygen ion assist conditions. Films were studied by X-ray diffraction (XRD), Auger electron spectroscopy (AES), resistivity and Rutherford back-scattering analysis (RBS).

Official source

https://infoscience.epfl.ch/entities/publication/59e25d18-b5f1-4648-84af-7e7071734ad0

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Davor Pavuna
1989
Journal Articles

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/59e25d18-b5f1-4648-84af-7e7071734ad0

About this result

Related concepts (32)

Electron-beam physical vapor deposition

Electron-beam physical vapor deposition, or EBPVD, is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a charged tungsten filament under high vacuum. The electron beam causes atoms from the target to transform into the gaseous phase. These atoms then precipitate into solid form, coating everything in the vacuum chamber (within line of sight) with a thin layer of the anode material.

Focused ion beam

Focused ion beam, also known as FIB, is a technique used particularly in the semiconductor industry, materials science and increasingly in the biological field for site-specific analysis, deposition, and ablation of materials. A FIB setup is a scientific instrument that resembles a scanning electron microscope (SEM). However, while the SEM uses a focused beam of electrons to image the sample in the chamber, a FIB setup uses a focused beam of ions instead.

Sputter deposition

Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K).

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Preparation of YBCO thin films by a four ion beam co-deposition system

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