VoltammetryVoltammetry is a category of electroanalytical methods used in analytical chemistry and various industrial processes. In voltammetry, information about an analyte is obtained by measuring the current as the potential is varied. The analytical data for a voltammetric experiment comes in the form of a voltammogram which plots the current produced by the analyte versus the potential of the working electrode. Voltammetry is the study of current as a function of applied potential.
Electrochemical potentialIn electrochemistry, the electrochemical potential (ECP), , is a thermodynamic measure of chemical potential that does not omit the energy contribution of electrostatics. Electrochemical potential is expressed in the unit of J/mol. Each chemical species (for example, "water molecules", "sodium ions", "electrons", etc.) has an electrochemical potential (a quantity with units of energy) at any given point in space, which represents how easy or difficult it is to add more of that species to that location.
Integrated circuit layout design protectionLayout designs (topographies) of integrated circuits are a field in the protection of intellectual property. In United States intellectual property law, a "mask work" is a two or three-dimensional layout or topography of an integrated circuit (IC or "chip"), i.e. the arrangement on a chip of semiconductor devices such as transistors and passive electronic components such as resistors and interconnections.
Electrochemical reaction mechanismIn electrochemistry, an electrochemical reaction mechanism is the step-by-step sequence of elementary steps, involving at least one outer-sphere electron transfer, by which an overall electrochemical reaction occurs. Elementary steps like proton coupled electron transfer and the movement of electrons between an electrode and substrate are special to electrochemical processes.
Electrochemical machiningElectrochemical machining (ECM) is a method of removing metal by an electrochemical process. It is normally used for mass production and is used for working extremely hard materials or materials that are difficult to machine using conventional methods. Its use is limited to electrically conductive materials. ECM can cut small or odd-shaped angles, intricate contours or cavities in hard and exotic metals, such as titanium aluminides, Inconel, Waspaloy, and high nickel, cobalt, and rhenium alloys.
Application-specific integrated circuitAn application-specific integrated circuit (ASIC ˈeɪsɪk) is an integrated circuit (IC) chip customized for a particular use, rather than intended for general-purpose use, such as a chip designed to run in a digital voice recorder or a high-efficiency video codec. Application-specific standard product chips are intermediate between ASICs and industry standard integrated circuits like the 7400 series or the 4000 series. ASIC chips are typically fabricated using metal–oxide–semiconductor (MOS) technology, as MOS integrated circuit chips.
MetalA metal (from Ancient Greek μέταλλον métallon 'mine, quarry, metal') is a material that, when freshly prepared, polished, or fractured, shows a lustrous appearance, and conducts electricity and heat relatively well. Metals are typically ductile (can be drawn into wires) and malleable (they can be hammered into thin sheets). These properties are the result of the metallic bond between the atoms or molecules of the metal. A metal may be a chemical element such as iron; an alloy such as stainless steel; or a molecular compound such as polymeric sulfur nitride.
Wear OSWear OS (also known simply as Wear and formerly Android Wear) is a version of Google's Android operating system designed for smartwatches and other wearables. By pairing with mobile phones running Android version 6.0 "Marshmallow" or newer, or iOS version 10.0 or newer with limited support from Google's pairing application, Wear OS integrates Google Assistant technology and mobile notifications into a smartwatch form factor. Wear OS supports Bluetooth, NFC, Wi-Fi, 3G, and LTE connectivity, as well as a range of features and applications.
ElectropolishingElectropolishing, also known as electrochemical polishing, anodic polishing, or electrolytic polishing (especially in the metallography field), is an electrochemical process that removes material from a metallic workpiece, reducing the surface roughness by levelling micro-peaks and valleys, improving the surface finish. Electropolishing is often compared to, but distinctly different from, electrochemical machining. It is used to polish, passivate, and deburr metal parts. It is often described as the reverse of electroplating.
Integrated circuit designIntegrated circuit design, or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography. IC design can be divided into the broad categories of digital and analog IC design. Digital IC design is to produce components such as microprocessors, FPGAs, memories (RAM, ROM, and flash) and digital ASICs.
Standard hydrogen electrodeIn electrochemistry, the standard hydrogen electrode (abbreviated SHE), is a redox electrode which forms the basis of the thermodynamic scale of oxidation-reduction potentials. Its absolute electrode potential is estimated to be 4.44 ± 0.02 V at 25 °C, but to form a basis for comparison with all other electrochemical reactions, hydrogen's standard electrode potential (E°) is declared to be zero volts at any temperature. Potentials of all other electrodes are compared with that of the standard hydrogen electrode at the same temperature.
MEMSMEMS (Microelectromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2.
