Photoelectric effectThe photoelectric effect is the emission of electrons when electromagnetic radiation, such as light, hits a material. Electrons emitted in this manner are called photoelectrons. The phenomenon is studied in condensed matter physics, solid state, and quantum chemistry to draw inferences about the properties of atoms, molecules and solids. The effect has found use in electronic devices specialized for light detection and precisely timed electron emission.
Ionizing radiationIonizing radiation (or ionising radiation), including nuclear radiation, consists of subatomic particles or electromagnetic waves that have sufficient energy to ionize atoms or molecules by detaching electrons from them. Some particles can travel up to 99% of the speed of light, and the electromagnetic waves are on the high-energy portion of the electromagnetic spectrum. Gamma rays, X-rays, and the higher energy ultraviolet part of the electromagnetic spectrum are ionizing radiation, whereas the lower energy ultraviolet, visible light, nearly all types of laser light, infrared, microwaves, and radio waves are non-ionizing radiation.
DØ experimentThe DØ experiment (sometimes written D0 experiment, or DZero experiment) was a worldwide collaboration of scientists conducting research on the fundamental nature of matter. DØ was one of two major experiments (the other was the CDF experiment) located at the Tevatron Collider at Fermilab in Batavia, Illinois. The Tevatron was the world's highest-energy accelerator from 1983 until 2009, when its energy was surpassed by the Large Hadron Collider. The DØ experiment stopped taking data in 2011, when the Tevatron shut down, but data analysis is still ongoing.
Elastic scatteringElastic scattering is a form of particle scattering in scattering theory, nuclear physics and particle physics. In this process, the kinetic energy of a particle is conserved in the center-of-mass frame, but its direction of propagation is modified (by interaction with other particles and/or potentials) meaning the two particles in the collision do not lose energy. Furthermore, while the particle's kinetic energy in the center-of-mass frame is constant, its energy in the lab frame is not.
Structural analysisStructural analysis is a branch of solid mechanics which uses simplified models for solids like bars, beams and shells for engineering decision making. Its main objective is to determine the effect of loads on the physical structures and their components. In contrast to theory of elasticity, the models used in structure analysis are often differential equations in one spatial variable. Structures subject to this type of analysis include all that must withstand loads, such as buildings, bridges, aircraft and ships.
PhotodetectorPhotodetectors, also called photosensors, are sensors of light or other electromagnetic radiation. There is a wide variety of photodetectors which may be classified by mechanism of detection, such as photoelectric or photochemical effects, or by various performance metrics, such as spectral response. Semiconductor-based photodetectors typically photo detector have a p–n junction that converts light photons into current. The absorbed photons make electron–hole pairs in the depletion region.
Radiation therapyRadiation therapy or radiotherapy, often abbreviated RT, RTx, or XRT, is a therapy using ionizing radiation, generally provided as part of cancer treatment to control or kill malignant cells and normally delivered by a linear accelerator. Radiation therapy may be curative in a number of types of cancer if they are localized to one area of the body. It may also be used as part of adjuvant therapy, to prevent tumor recurrence after surgery to remove a primary malignant tumor (for example, early stages of breast cancer).
Cross section (physics)In physics, the cross section is a measure of the probability that a specific process will take place when some kind of radiant excitation (e.g. a particle beam, sound wave, light, or an X-ray) intersects a localized phenomenon (e.g. a particle or density fluctuation). For example, the Rutherford cross-section is a measure of probability that an alpha particle will be deflected by a given angle during an interaction with an atomic nucleus. Cross section is typically denoted σ (sigma) and is expressed in units of area, more specifically in barns.
PhotolithographyIn integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Typically, ultraviolet light is used to transfer a geometric design from an optical mask to a light-sensitive chemical (photoresist) coated on the substrate.
SensorA sensor is a device that produces an output signal for the purpose of sensing a physical phenomenon. In the broadest definition, a sensor is a device, module, machine, or subsystem that detects events or changes in its environment and sends the information to other electronics, frequently a computer processor. Sensors are used in everyday objects such as touch-sensitive elevator buttons (tactile sensor) and lamps which dim or brighten by touching the base, and in innumerable applications of which most people are never aware.
High-energy nuclear physicsHigh-energy nuclear physics studies the behavior of nuclear matter in energy regimes typical of high-energy physics. The primary focus of this field is the study of heavy-ion collisions, as compared to lighter atoms in other particle accelerators. At sufficient collision energies, these types of collisions are theorized to produce the quark–gluon plasma. In peripheral nuclear collisions at high energies one expects to obtain information on the electromagnetic production of leptons and mesons that are not accessible in electron–positron colliders due to their much smaller luminosities.
Etching (microfabrication)Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography. Other situations require a more durable mask, such as silicon nitride.
