Publication

Surface microfabricated SU-8 devices with integrated electrodes for scanning probe microscopy

Giovanni Boero, Radivoje Popovic
2005
Talks

Abstract

We report here on a new method to release functional SU-8 micro-components with embedded and integrated metal electrodes from the surface, based on isotropic SF6 dry etching of a poly-silicon sacrificial layer. This new fast and clean release technique allows a reproducible fabrication of SU-8 structures with integrated metal devices without risk of damage or altering their performance.

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Giovanni Boero, Radivoje Popovic
2005
Talks

Abstract

Official source

Related concepts (23)

Semiconductor device fabrication

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.

Integrated circuit

An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.

MEMS

MEMS (Microelectromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2.

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Surface microfabricated SU-8 devices with integrated electrodes for scanning probe microscopy

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