Data link layerThe data link layer, or layer 2, is the second layer of the seven-layer OSI model of computer networking. This layer is the protocol layer that transfers data between nodes on a network segment across the physical layer. The data link layer provides the functional and procedural means to transfer data between network entities and may also provide the means to detect and possibly correct errors that can occur in the physical layer. The data link layer is concerned with local delivery of frames between nodes on the same level of the network.
Telecommunications linkIn a telecommunications network, a link is a communication channel that connects two or more devices for the purpose of data transmission. The link may be a dedicated physical link or a virtual circuit that uses one or more physical links or shares a physical link with other telecommunications links. A telecommunications link is generally based on one of several types of information transmission paths such as those provided by communication satellites, terrestrial radio communications infrastructure and computer networks to connect two or more points.
Serial communicationIn telecommunication and data transmission, serial communication is the process of sending data one bit at a time, sequentially, over a communication channel or computer bus. This is in contrast to parallel communication, where several bits are sent as a whole, on a link with several parallel channels. Serial communication is used for all long-haul communication and most computer networks, where the cost of cable and synchronization difficulties make parallel communication impractical.
Space ShuttleThe Space Shuttle is a retired, partially reusable low Earth orbital spacecraft system operated from 1981 to 2011 by the U.S. National Aeronautics and Space Administration (NASA) as part of the Space Shuttle program. Its official program name was Space Transportation System (STS), taken from a 1969 plan for a system of reusable spacecraft where it was the only item funded for development. The first (STS-1) of four orbital test flights occurred in 1981, leading to operational flights (STS-5) beginning in 1982.
Landing gearLanding gear is the undercarriage of an aircraft or spacecraft that is used for takeoff or landing. For aircraft it is generally needed for both. It was also formerly called alighting gear by some manufacturers, such as the Glenn L. Martin Company. For aircraft, Stinton makes the terminology distinction undercarriage (British) = landing gear (US). For aircraft, the landing gear supports the craft when it is not flying, allowing it to take off, land, and taxi without damage.
Tensor Processing UnitTensor Processing Unit (TPU) is an AI accelerator application-specific integrated circuit (ASIC) developed by Google for neural network machine learning, using Google's own TensorFlow software. Google began using TPUs internally in 2015, and in 2018 made them available for third party use, both as part of its cloud infrastructure and by offering a smaller version of the chip for sale. Compared to a graphics processing unit, TPUs are designed for a high volume of low precision computation (e.g.
Ground (electricity)In electrical engineering, ground or earth may be a reference point in an electrical circuit from which voltages are measured, a common return path for electric current, or a direct physical connection to the Earth. Electrical circuits may be connected to ground for several reasons. Exposed conductive parts of electrical equipment are connected to ground, to protect users from electrical shock hazard. If internal insulation fails, dangerous voltages may appear on the exposed conductive parts.
Wireless power transferWireless power transfer (WPT), wireless power transmission, wireless energy transmission (WET), or electromagnetic power transfer is the transmission of electrical energy without wires as a physical link. In a wireless power transmission system, an electrically powered transmitter device generates a time-varying electromagnetic field that transmits power across space to a receiver device; the receiver device extracts power from the field and supplies it to an electrical load.
Data PreprocessingData preprocessing can refer to manipulation or dropping of data before it is used in order to ensure or enhance performance, and is an important step in the data mining process. The phrase "garbage in, garbage out" is particularly applicable to data mining and machine learning projects. Data collection methods are often loosely controlled, resulting in out-of-range values, impossible data combinations, and missing values, amongst other issues. Analyzing data that has not been carefully screened for such problems can produce misleading results.
Apollo Lunar ModuleThe Apollo Lunar Module (LM ˈlɛm), originally designated the Lunar Excursion Module (LEM), was the lunar lander spacecraft that was flown between lunar orbit and the Moon's surface during the United States' Apollo program. It was the first crewed spacecraft to operate exclusively in the airless vacuum of space, and remains the only crewed vehicle to land anywhere beyond Earth. Structurally and aerodynamically incapable of flight through Earth's atmosphere, the two-stage lunar module was ferried to lunar orbit attached to the Apollo command and service module (CSM), about twice its mass.
Rail transportRail transport (also known as train transport) is a means of transport that transfers passengers and goods on wheeled vehicles running on rails, which are incorporated in tracks. In contrast to road transport, where the vehicles run on a prepared flat surface, rail vehicles (rolling stock) are directionally guided by the tracks on which they run. Tracks usually consist of steel rails.Rolling stock in a rail transport system generally encounters lower frictional resistance than rubber-tyred road vehicles, so passenger and freight cars (carriages and wagons) can be coupled into longer trains.
Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
