Publication

A Qos-Enabled On-Die Interconnect Fabric For Kilo-Node Chips

Boris Robert Grot
2012
Journal Articles

Abstract

To meet rapidly growing performance demands and energy constraints, future chips will likely feature thousands of on-die resources. Existing network-on-chip solutions weren't designed for scalability and will be unable to meet future interconnect demands. A hybrid network-on-chip architecture called Kilo-NoC co-optimizes topology, flow control, and quality of service to achieve significant gains in efficiency.

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A Qos-Enabled On-Die Interconnect Fabric For Kilo-Node Chips

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System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

Quantitative Modelling and Comparison of Communication Schemes to Guarantee Quality-of-Service in Networks-on-Chip