BoilingBoiling is the rapid phase transition from liquid to gas or vapor; the reverse of boiling is condensation. Boiling occurs when a liquid is heated to its boiling point, so that the vapour pressure of the liquid is equal to the pressure exerted on the liquid by the surrounding atmosphere. Boiling and evaporation are the two main forms of liquid vapourization. There are two main types of boiling: nucleate boiling where small bubbles of vapour form at discrete points, and critical heat flux boiling where the boiling surface is heated above a certain critical temperature and a film of vapour forms on the surface.
Phase diagramA phase diagram in physical chemistry, engineering, mineralogy, and materials science is a type of chart used to show conditions (pressure, temperature, volume, etc.) at which thermodynamically distinct phases (such as solid, liquid or gaseous states) occur and coexist at equilibrium. Common components of a phase diagram are lines of equilibrium or phase boundaries, which refer to lines that mark conditions under which multiple phases can coexist at equilibrium. Phase transitions occur along lines of equilibrium.
Phase (matter)In the physical sciences, a phase is a region of material that is chemically uniform, physically distinct, and (often) mechanically separable. In a system consisting of ice and water in a glass jar, the ice cubes are one phase, the water is a second phase, and the humid air is a third phase over the ice and water. The glass of the jar is another separate phase. (See .) More precisely, a phase is a region of space (a thermodynamic system), throughout which all physical properties of a material are essentially uniform.
Thermodynamic temperatureThermodynamic temperature is a quantity defined in thermodynamics as distinct from kinetic theory or statistical mechanics. Historically, thermodynamic temperature was defined by Lord Kelvin in terms of a macroscopic relation between thermodynamic work and heat transfer as defined in thermodynamics, but the kelvin was redefined by international agreement in 2019 in terms of phenomena that are now understood as manifestations of the kinetic energy of free motion of microscopic particles such as atoms, molecules, and electrons.
Chip carrierIn electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large. Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is "flat pack".
Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
Deep water source coolingDeep water source cooling (DWSC) or deep water air cooling is a form of air cooling for process and comfort space cooling which uses a large body of naturally cold water as a heat sink. It uses water at 4 to 10 degrees Celsius drawn from deep areas within lakes, oceans, aquifers or rivers, which is pumped through the one side of a heat exchanger. On the other side of the heat exchanger, cooled water is produced. Water is most dense at at standard atmospheric pressure. Thus as water cools below 3.
PumpA pump is a device that moves fluids (liquids or gases), or sometimes slurries, by mechanical action, typically converted from electrical energy into hydraulic energy. Mechanical pumps serve in a wide range of applications such as pumping water from wells, aquarium filtering, pond filtering and aeration, in the car industry for water-cooling and fuel injection, in the energy industry for pumping oil and natural gas or for operating cooling towers and other components of heating, ventilation and air conditioning systems.
Convection (heat transfer)Convection (or convective heat transfer) is the transfer of heat from one place to another due to the movement of fluid. Although often discussed as a distinct method of heat transfer, convective heat transfer involves the combined processes of conduction (heat diffusion) and advection (heat transfer by bulk fluid flow). Convection is usually the dominant form of heat transfer in liquids and gases. Note that this definition of convection is only applicable in Heat transfer and thermodynamic contexts.
Passive coolingPassive cooling is a building design approach that focuses on heat gain control and heat dissipation in a building in order to improve the indoor thermal comfort with low or no energy consumption. This approach works either by preventing heat from entering the interior (heat gain prevention) or by removing heat from the building (natural cooling). Natural cooling utilizes on-site energy, available from the natural environment, combined with the architectural design of building components (e.g.
Adiabatic processIn thermodynamics, an adiabatic process (Greek: adiábatos, "impassable") is a type of thermodynamic process that occurs without transferring heat or mass between the thermodynamic system and its environment. Unlike an isothermal process, an adiabatic process transfers energy to the surroundings only as work. As a key concept in thermodynamics, the adiabatic process supports the theory that explains the first law of thermodynamics. Some chemical and physical processes occur too rapidly for energy to enter or leave the system as heat, allowing a convenient "adiabatic approximation".
Operating temperatureAn operating temperature is the allowable temperature range of the local ambient environment at which an electrical or mechanical device operates. The device will operate effectively within a specified temperature range which varies based on the device function and application context, and ranges from the minimum operating temperature to the maximum operating temperature (or peak operating temperature). Outside this range of safe operating temperatures the device may fail. It is one component of reliability engineering.
