Electrical connectorComponents of an electrical circuit are electrically connected if an electric current can run between them through an electrical conductor. An electrical connector is an electromechanical device used to create an electrical connection between parts of an electrical circuit, or between different electrical circuits, thereby joining them into a larger circuit. Most electrical connectors have a gender - i.e. the male component, called a plug, connects to the female component, or socket.
Unit testingIn computer programming, unit testing is a software testing method by which individual units of source code—sets of one or more computer program modules together with associated control data, usage procedures, and operating procedures—are tested to determine whether they are fit for use. It is a standard step in development and implementation approaches such as Agile. Before unit testing, capture and replay testing tools were the norm. In 1997, Kent Beck and Erich Gamma developed and released JUnit, a unit test framework that became popular with Java developers.
SolderSolder (UKˈsɒldə,_ˈsəʊldə; NA: ˈsɒdər) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
API testingAPI testing is a type of software testing that involves testing application programming interfaces (APIs) directly and as part of integration testing to determine if they meet expectations for functionality, reliability, performance, and security. Since APIs lack a GUI, API testing is performed at the message layer. API testing is now considered critical for automating testing because APIs now serve as the primary interface to application logic and because GUI tests are difficult to maintain with the short release cycles and frequent changes commonly used with Agile software development and DevOps.
Heat exchangerA heat exchanger is a system used to transfer heat between a source and a working fluid. Heat exchangers are used in both cooling and heating processes. The fluids may be separated by a solid wall to prevent mixing or they may be in direct contact. They are widely used in space heating, refrigeration, air conditioning, power stations, chemical plants, petrochemical plants, petroleum refineries, natural-gas processing, and sewage treatment.
Thermal shockThermal shock is a phenomenon characterized by a rapid change in temperature that results in a transient mechanical load on an object. The load is caused by the differential expansion of different parts of the object due to the temperature change. This differential expansion can be understood in terms of strain, rather than stress. When the strain exceeds the tensile strength of the material, it can cause cracks to form and eventually lead to structural failure.
Fusion powerFusion power is a proposed form of power generation that would generate electricity by using heat from nuclear fusion reactions. In a fusion process, two lighter atomic nuclei combine to form a heavier nucleus, while releasing energy. Devices designed to harness this energy are known as fusion reactors. Research into fusion reactors began in the 1940s, but as of 2023, no device has reached net power. Fusion processes require fuel and a confined environment with sufficient temperature, pressure, and confinement time to create a plasma in which fusion can occur.
Magnetic levitationMagnetic levitation (maglev) or magnetic suspension is a method by which an object is suspended with no support other than magnetic fields. Magnetic force is used to counteract the effects of the gravitational force and any other forces. The two primary issues involved in magnetic levitation are lifting forces: providing an upward force sufficient to counteract gravity, and stability: ensuring that the system does not spontaneously slide or flip into a configuration where the lift is neutralized.
Temperature gradientA temperature gradient is a physical quantity that describes in which direction and at what rate the temperature changes the most rapidly around a particular location. The temperature gradient is a dimensional quantity expressed in units of degrees (on a particular temperature scale) per unit length. The SI unit is kelvin per meter (K/m). Temperature gradients in the atmosphere are important in the atmospheric sciences (meteorology, climatology and related fields). Assuming that the temperature T is an intensive quantity, i.
Thermal energy storageThermal energy storage (TES) is achieved with widely different technologies. Depending on the specific technology, it allows excess thermal energy to be stored and used hours, days, months later, at scales ranging from the individual process, building, multiuser-building, district, town, or region. Usage examples are the balancing of energy demand between daytime and nighttime, storing summer heat for winter heating, or winter cold for summer air conditioning (Seasonal thermal energy storage).
Vacuum flaskA vacuum flask (also known as a Dewar flask, Dewar bottle or thermos) is an insulating storage vessel that greatly lengthens the time over which its contents remain hotter or cooler than the flask's surroundings. Invented by Sir James Dewar in 1892, the vacuum flask consists of two flasks, placed one within the other and joined at the neck. The gap between the two flasks is partially evacuated of air, creating a near-vacuum which significantly reduces heat transfer by conduction or convection.
Wire bondingWire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages.
