Publication

Stress distribution in cantilever – base joints

Thomas Maeder
2003
Reports

Abstract

Estimation of the stress distribution in the solder or glue joint between a cantilever and its base, and of the corresponding bending stress distribution in the cantilever. This reports details results of modelling of the stresses in the solder or glue joints linking a cantilever to its base, using analytical and finite difference methods. The additional compliance due to joint deformation and its effect on the resonance frequency is also calculated. The parameters used in the examples are those of the MilliNewton force sensor (the three force ranges). Additionally, the effect of variations of joint length and joint elastic modulus (solder or glue) are studied and discussed. Also, the effect of introducing a yield stress for the joint material (valid especially for solder) is examined. Finally, the model is applied to previous solder strength studies and to the case of glass sealing.

Official source

https://infoscience.epfl.ch/entities/publication/2b377fd2-d247-4155-8a2e-e10e8aa75286

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Thomas Maeder
2003
Reports

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/2b377fd2-d247-4155-8a2e-e10e8aa75286

About this result

Related concepts (32)

Stress (mechanics)

In continuum mechanics, stress is a physical quantity that describes forces present during deformation. An object being pulled apart, such as a stretched elastic band, is subject to tensile stress and may undergo elongation. An object being pushed together, such as a crumpled sponge, is subject to compressive stress and may undergo shortening. The greater the force and the smaller the cross-sectional area of the body on which it acts, the greater the stress. Stress has units of force per area, such as newtons per square meter (N/m2) or pascal (Pa).

Stress–strain analysis

Stress–strain analysis (or stress analysis) is an engineering discipline that uses many methods to determine the stresses and strains in materials and structures subjected to forces. In continuum mechanics, stress is a physical quantity that expresses the internal forces that neighboring particles of a continuous material exert on each other, while strain is the measure of the deformation of the material. In simple terms we can define stress as the force of resistance per unit area, offered by a body against deformation.

Creep (deformation)

In materials science, creep (sometimes called cold flow) is the tendency of a solid material to undergo slow deformation while subject to persistent mechanical stresses. It can occur as a result of long-term exposure to high levels of stress that are still below the yield strength of the material. Creep is more severe in materials that are subjected to heat for long periods and generally increase as they near their melting point. The rate of deformation is a function of the material's properties, exposure time, exposure temperature and the applied structural load.

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Stress distribution in cantilever – base joints

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