Overview on low temperature co-fired ceramic sensors

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This article describes the design and the characterization of the ANTIGONE (ANalog To dIGital cONvErter) ASIC (Application Specific Integrated Circuit) built in AMS 0.35 m technology for low dc-current sensing. This energy-efficient ASIC was specifically d ...

Plasma formation in micro- and nano-scales enables an ultrahigh-dv/dt picosecond switching in an integrated circuit form factor. Such on-chip plasma devices could provide a transformative approach to achieving high-power levels at very high frequencies, fa ...

The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been dri ...

Like integrated electronics, integrated photonics such as Silicon Photonics benefit from increased device-density on a single chip. Silicon is an excellent material for integrated photonics because its high refractive index allows devices to be made small, ...

Source reconstruction methods have many applications such as antenna diagnosis, calculating far-field radiated emissions, and identifying incompatible sources on integrated circuits or printed circuit boards. In this paper, the Gerchberg-Saxton algorithm i ...

In this paper, the impact of an increasing number of arbitrary electrical/electronic devices on the overall radiated emissions is investigated. Understanding and quantifying such an impact are prerequisites to the proper evaluation of electromagnetic compa ...

Printed electronics has promised to deliver low-cost, large-area and flexible electronics for mass-market applications for some time; however, so far one limiting factor has been device performance. Over the last decade, great progress has been made in ter ...

This paper presents the design and development of a coplanar capacitive proximity sensor for the detection of the gap between the edges of dielectric foils. The finite element analysis is applied to study the design of the sensor by investigating the effec ...

In this work, we demonstrate a new thermal management approach for direct cooling of GaN-on-Si power integrated circuits (ICs), in which the Si substrate functions as a microfluidic heat sink, turning Si into a cost-effective, high thermal performance subs ...

Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

This paper presents the design of an application-specific integrated circuit (ASIC) with all the necessary electronic blocks to read out and control Conjugate Surfaces Flexure Hinge (CSFH) microgrippers. The ASIC was fabricated using a high-voltage 0.35 mu ...

Smart agriculture systems, which integrate sensors and data analysis into agricultural production processes, are increasingly proving an effective solution for reducing food production waste, yield production increase, and product quality improvement. In t ...

Overview on low temperature co-fired ceramic sensors

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ANTIGONE: A Programmable Energy-Efficient Current Digitizer for an ISFET Wearable Sweat Sensing System

Kilowatt-range Picosecond Switching Based on Microplasma Devices

A new versatile hybrid MEMS technology for high sensitivity, fluid proof sensing applications

Integration of MEMS in Silicon Photonics

Source Reconstruction Method Using Phase-Less Magnetic Near-Field Measurements: Application of the Method of Moment with Roof-Top Basis Functions

EMC Impact of Disturbances Generated by Multiple Sources

Dimensional scaling of high-speed printed organic transistors enabling high-frequency operation

Design and printing of a coplanar capacitive proximity sensor to detect the gap between dielectric foils edges

Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

CMOS-Based Readout and Control Electronics for Microgrippers

A Battery-Free Wireless Smart Sensor platform with Bluetooth Low Energy Connectivity for Smart Agriculture