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The design of small solenoids without/with-partial insulation (PI) among turns or layers has been proven to grant higher thermal stability than for standard insulated cases. This technology also implies higher safety standards, by e.g. reducing the coil vo ...
IEEE Institute of Electrical and Electronics Engineers2025
We introduce the world’s first SPAD family design in 130 nm SiGe BiCMOS process. At 1.8 µm, we achieved the smallest pitch on record thanks to guard-ring sharing techniques, while keeping a relatively high fill factor of 24.2%. 4×4 SPAD arrays with two par ...
One of the most promising platforms for the realization of spin-based quantum computing are planar germanium quantum wells embedded between silicon-germanium barriers. To achieve comparably thin stacks with little surface roughness, this type of heterostru ...
