Publication

Lifetime assessment of soft solder joints on the base of the metallurgical behaviour of Sn62Pb36Ag2

Ludger Weber
1997
Conference Papers

Abstract

The introduction of new packages as well as the ongoing miniaturization in SMT make the evaluation of the reliability of solder joints a permanent task. Passive thermal cycling is an important test to evaluate the lifetime of solder joints. However, tin-lead solder behaves viscoplastically. Therefore it is mandatory to take the metallurgical behaviour of the solder into account when accelerated tests are designed. Two different deformation mechanisms occur, depending on the temperatures of the test as well as the temperature gradient: Grain boundary sliding (GBS) and dislocation climb (DC). Therefore, one is not free in choosing the parameters of a testcycle because test parameters (temperature ramp, dwell time) have a major influence on the growth of cracks. Furthermore the stress under service conditions must be taken into account.

Official source

https://infoscience.epfl.ch/entities/publication/1bb14d5e-e946-4ba4-9937-4285c8879859

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Ludger Weber
1997
Conference Papers

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/1bb14d5e-e946-4ba4-9937-4285c8879859

About this result

Related concepts (25)

Solder

Solder (UKˈsɒldə,_ˈsəʊldə; NA: ˈsɒdər) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.

Soldering

Soldering (USˈsɒdərɪŋ; UKˈsoʊldərɪŋ) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint. Soldering is commonly used in the electronics industry for the manufacture and repair of printed circuit boards (PCBs) and other electronic components. It is also used in plumbing and metalwork, as well as in the manufacture of jewelry and other decorative items.

Creep (deformation)

In materials science, creep (sometimes called cold flow) is the tendency of a solid material to undergo slow deformation while subject to persistent mechanical stresses. It can occur as a result of long-term exposure to high levels of stress that are still below the yield strength of the material. Creep is more severe in materials that are subjected to heat for long periods and generally increase as they near their melting point. The rate of deformation is a function of the material's properties, exposure time, exposure temperature and the applied structural load.

Related publications (1)

Lifetime assessment of soft solder joints on the base of the metallurgical behaviour of Sn62Pb36Ag2

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