Publication

Efficient optimization of high vacuum chemical vapor deposition of niobium oxide on full wafer scale

Patrik Willi Hoffmann, Giacomo Benvenuti
2010
Conference Papers

Abstract

A systematic study of niobium oxide deposition using niobium tetraethoxy-dimethyl-amino-ethoxide (Nb(OEt)(4)(dmae)) precursor is presented. The deposition process was conducted in a high-vacuum chemical vapor deposition machine with precursor flux gradient capability. An efficient optimization of the deposition process was achieved and both mass-transport- and chemical-reaction-limited regimes were identified.

Official source

https://infoscience.epfl.ch/entities/publication/17ade6ab-0b04-4748-a76b-b1589fab3834

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Patrik Willi Hoffmann, Giacomo Benvenuti
2010
Conference Papers

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/17ade6ab-0b04-4748-a76b-b1589fab3834

About this result

Related concepts (32)

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Evaporation (deposition)

Evaporation is a common method of thin-film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel directly to the target object (substrate), where they condense back to a solid state. Evaporation is used in microfabrication, and to make macro-scale products such as metallized plastic film. Evaporation involves two basic processes: a hot source material evaporates and condenses on the substrate. It resembles the familiar process by which liquid water appears on the lid of a boiling pot.

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

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Efficient optimization of high vacuum chemical vapor deposition of niobium oxide on full wafer scale

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