Multi-core processorA multi-core processor is a microprocessor on a single integrated circuit with two or more separate processing units, called cores, each of which reads and executes program instructions. The instructions are ordinary CPU instructions (such as add, move data, and branch) but the single processor can run instructions on separate cores at the same time, increasing overall speed for programs that support multithreading or other parallel computing techniques.
Network on a chipA network on a chip or network-on-chip (NoC ˌɛnˌoʊˈsiː or nɒk ) is a network-based communications subsystem on an integrated circuit ("microchip"), most typically between modules in a system on a chip (SoC). The modules on the IC are typically semiconductor IP cores schematizing various functions of the computer system, and are designed to be modular in the sense of network science. The network on chip is a router-based packet switching network between SoC modules.
Manycore processorManycore processors are special kinds of multi-core processors designed for a high degree of parallel processing, containing numerous simpler, independent processor cores (from a few tens of cores to thousands or more). Manycore processors are used extensively in embedded computers and high-performance computing. Manycore processors are distinct from multi-core processors in being optimized from the outset for a higher degree of explicit parallelism, and for higher throughput (or lower power consumption) at the expense of latency and lower single-thread performance.
Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Xeon PhiXeon Phi was a series of x86 manycore processors designed and made by Intel. It was intended for use in supercomputers, servers, and high-end workstations. Its architecture allowed use of standard programming languages and application programming interfaces (APIs) such as OpenMP. Xeon Phi launched in 2010. Since it was originally based on an earlier GPU design (codenamed "Larrabee") by Intel that was cancelled in 2009, it shared application areas with GPUs.
Cognitive architectureA cognitive architecture refers to both a theory about the structure of the human mind and to a computational instantiation of such a theory used in the fields of artificial intelligence (AI) and computational cognitive science. The formalized models can be used to further refine a comprehensive theory of cognition and as a useful artificial intelligence program. Successful cognitive architectures include ACT-R (Adaptive Control of Thought - Rational) and SOAR.
Heterogeneous computingHeterogeneous computing refers to systems that use more than one kind of processor or core. These systems gain performance or energy efficiency not just by adding the same type of processors, but by adding dissimilar coprocessors, usually incorporating specialized processing capabilities to handle particular tasks. Usually heterogeneity in the context of computing referred to different instruction-set architectures (ISA), where the main processor has one and other processors have another - usually a very different - architecture (maybe more than one), not just a different microarchitecture (floating point number processing is a special case of this - not usually referred to as heterogeneous).
Deep learningDeep learning is part of a broader family of machine learning methods, which is based on artificial neural networks with representation learning. The adjective "deep" in deep learning refers to the use of multiple layers in the network. Methods used can be either supervised, semi-supervised or unsupervised.
Through-silicon viaIn electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
Intel Core (microarchitecture)The Intel Core microarchitecture (provisionally referred to as Next Generation Micro-architecture, and developed as Merom) is a multi-core processor microarchitecture launched by Intel in mid-2006. It is a major evolution over the Yonah, the previous iteration of the P6 microarchitecture series which started in 1995 with Pentium Pro. It also replaced the NetBurst microarchitecture, which suffered from high power consumption and heat intensity due to an inefficient pipeline designed for high clock rate.
Optical wireless communicationsOptical wireless communications (OWC) is a form of optical communication in which unguided visible, infrared (IR), or ultraviolet (UV) light is used to carry a signal. It is generally used in short-range communication. OWC systems operating in the visible band (390–750 nm) are commonly referred to as visible light communication (VLC). VLC systems take advantage of light-emitting diodes (LEDs) which can be pulsed at very high speeds without a noticeable effect on the lighting output and human eye.
Reconfigurable computingReconfigurable computing is a computer architecture combining some of the flexibility of software with the high performance of hardware by processing with very flexible high speed computing fabrics like field-programmable gate arrays (FPGAs). The principal difference when compared to using ordinary microprocessors is the ability to make substantial changes to the datapath itself in addition to the control flow. On the other hand, the main difference from custom hardware, i.e.
Free-space optical communicationFree-space optical communication (FSO) is an optical communication technology that uses light propagating in free space to wirelessly transmit data for telecommunications or computer networking. "Free space" means air, outer space, vacuum, or something similar. This contrasts with using solids such as optical fiber cable. The technology is useful where the physical connections are impractical due to high costs or other considerations. Optical communications, in various forms, have been used for thousands of years.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
SupercomputerA supercomputer is a computer with a high level of performance as compared to a general-purpose computer. The performance of a supercomputer is commonly measured in floating-point operations per second (FLOPS) instead of million instructions per second (MIPS). Since 2017, there have existed supercomputers which can perform over 1017 FLOPS (a hundred quadrillion FLOPS, 100 petaFLOPS or 100 PFLOPS). For comparison, a desktop computer has performance in the range of hundreds of gigaFLOPS (1011) to tens of teraFLOPS (1013).
Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
System on a chipA system on a chip or system-on-chip (SoC ,ˈɛsoʊsiː; pl. SoCs ,ˈɛsoʊsiːz) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip.
Semiconductor intellectual property coreIn electronic design, a semiconductor intellectual property core (SIP core), IP core, or IP block is a reusable unit of logic, cell, or integrated circuit layout design that is the intellectual property of one party. IP cores can be licensed to another party or owned and used by a single party. The term comes from the licensing of the patent or source code copyright that exists in the design. Designers of system on chip (SoC), application-specific integrated circuits (ASIC) and systems of field-programmable gate array (FPGA) logic can use IP cores as building blocks.
Green computingGreen computing, green IT (Information Technology), or ICT sustainability, is the study and practice of environmentally sustainable computing or IT. The goals of green computing are similar to green chemistry: reduce the use of hazardous materials, maximize energy efficiency during the product's lifetime, increase the recyclability or biodegradability of defunct products and factory waste. Green computing is important for all classes of systems, ranging from handheld systems to large-scale data centers.
Convolutional neural networkConvolutional neural network (CNN) is a regularized type of feed-forward neural network that learns feature engineering by itself via filters (or kernel) optimization. Vanishing gradients and exploding gradients, seen during backpropagation in earlier neural networks, are prevented by using regularized weights over fewer connections. For example, for each neuron in the fully-connected layer 10,000 weights would be required for processing an image sized 100 × 100 pixels.
