Current sensingIn electrical engineering, current sensing is any one of several techniques used to measure electric current. The measurement of current ranges from picoamps to tens of thousands of amperes. The selection of a current sensing method depends on requirements such as magnitude, accuracy, bandwidth, robustness, cost, isolation or size. The current value may be directly displayed by an instrument, or converted to digital form for use by a monitoring or control system.
Flexible manufacturing systemA flexible manufacturing system (FMS) is a manufacturing system in which there is some amount of flexibility that allows the system to react in case of changes, whether predicted or unpredicted. This flexibility is generally considered to fall into two categories, which both contain numerous subcategories. The first category is called as routing flexibility, which covers the system's ability to be changed to produce new product types, and ability to change the order of operations executed on a part.
3D modelingIn 3D computer graphics, 3D modeling is the process of developing a mathematical coordinate-based representation of any surface of an object (inanimate or living) in three dimensions via specialized software by manipulating edges, vertices, and polygons in a simulated 3D space. Three-dimensional (3D) models represent a physical body using a collection of points in 3D space, connected by various geometric entities such as triangles, lines, curved surfaces, etc.
Current densityIn electromagnetism, current density is the amount of charge per unit time that flows through a unit area of a chosen cross section. The current density vector is defined as a vector whose magnitude is the electric current per cross-sectional area at a given point in space, its direction being that of the motion of the positive charges at this point. In SI base units, the electric current density is measured in amperes per square metre. Assume that A (SI unit: m2) is a small surface centred at a given point M and orthogonal to the motion of the charges at M.
Link layerIn computer networking, the link layer is the lowest layer in the Internet protocol suite, the networking architecture of the Internet. The link layer is the group of methods and communications protocols confined to the link that a host is physically connected to. The link is the physical and logical network component used to interconnect hosts or nodes in the network and a link protocol is a suite of methods and standards that operate only between adjacent network nodes of a network segment.
Network layerIn the seven-layer OSI model of computer networking, the network layer is layer 3. The network layer is responsible for packet forwarding including routing through intermediate routers. The network layer provides the means of transferring variable-length network packets from a source to a destination host via one or more networks. Within the service layering semantics of the OSI (Open Systems Interconnection) network architecture, the network layer responds to service requests from the transport layer and issues service requests to the data link layer.
Fused filament fabricationFused filament fabrication (FFF), also known as fused deposition modeling (with the trademarked acronym FDM), or filament freeform fabrication, is a 3D printing process that uses a continuous filament of a thermoplastic material. Filament is fed from a large spool through a moving, heated printer extruder head, and is deposited on the growing work. The print head is moved under computer control to define the printed shape.
Small Island Developing StatesSmall Island Developing States (SIDS) are a group of developing countries that are small island countries and tend to share similar sustainable development challenges. These include small but growing populations, limited resources, remoteness, susceptibility to natural disasters, vulnerability to external shocks, excessive dependence on international trade, and fragile environments.
Sol–gel processIn materials science, the sol–gel process is a method for producing solid materials from small molecules. The method is used for the fabrication of metal oxides, especially the oxides of silicon (Si) and titanium (Ti). The process involves conversion of monomers into a colloidal solution (sol) that acts as the precursor for an integrated network (or gel) of either discrete particles or network polymers. Typical precursors are metal alkoxides. Sol-gel process is used to produce ceramic nanoparticles.
3D scanning3D scanner is the process of analyzing a real-world object or environment to collect three dimensional data of its shape and possibly its appearance (e.g. color). The collected data can then be used to construct digital 3D models. A 3D scanner can be based on many different technologies, each with its own limitations, advantages and costs. Many limitations in the kind of objects that can be digitised are still present. For example, optical technology may encounter many difficulties with dark, shiny, reflective or transparent objects.
Session layerIn the seven-layer OSI model of computer networking, the session layer is layer 5. The session layer provides the mechanism for opening, closing and managing a session between end-user application processes, i.e., a semi-permanent dialogue. Communication sessions consist of requests and responses that occur between applications. Session-layer services are commonly used in application environments that make use of remote procedure calls (RPCs). An example of a session-layer protocol is the OSI protocol suite session-layer protocol, also known as X.
