Publication

Deposition on Curved Surfaces by Means of E-Beam Evaporation

2005
Student Projects

Abstract

Recently, some research effort has been instigated towards micro and nano patterning of curved surfaces, as system miniaturization by means of patterned planar surfaces has practically reached its limits. In contrast to the more practical approach of existing research, the idea of this project was to do basic research on one effect encountered especially during vapour deposition on curved surfaces.

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2005
Student Projects

Abstract

Official source

Related concepts (32)

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

Vacuum deposition

Vacuum deposition , also known as vacuum coating or thin-film deposition, is a group of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure (i.e., vacuum). The deposited layers can range from a thickness of one atom up to millimeters, forming freestanding structures. Multiple layers of different materials can be used, for example to form optical coatings.

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

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Deposition on Curved Surfaces by Means of E-Beam Evaporation

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