Publication

Effect of substrate crystalline morphology on the adhesion of plasma enhanced chemical vapor deposited thin silicon oxide coatings on polyamide

Jan-Anders Edvin Maansson, Yves Leterrier, John Christopher Plummer, Andrzej Kulik, Gil Rochat, Robert Szoszkiewicz
2004
Journal Articles

Abstract

The influence of the surface morphology of semicrystalline polyamide 12 PA12! on the adhesion of thin silicon oxide coatings is analyzed by means of uniaxial fragmentation tests and scanning local-acceleration microscopy SLAM!. Two types of PA12 substrates are investigated, namely, as-received PA12, which contains large spherulites, and quenched PA12, which has a relatively smooth, homogeneous surface structure. The adhesion of the coating is found to be identical for the two types of PA12. This indicates that plasma deposition of the oxide leads to an equivalent functionalization of the two types of surfaces. Nonetheless, localized delamination is observed at spherulite boundaries, and is argued to result from strain concentrations in the corresponding soft zones, revealed by SLAM measurements.

Official source

https://infoscience.epfl.ch/entities/publication/08980be6-0ca9-40c6-8f2d-f29a4b8d8a55

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Jan-Anders Edvin Maansson, Yves Leterrier, John Christopher Plummer, Andrzej Kulik, Gil Rochat, Robert Szoszkiewicz
2004
Journal Articles

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/08980be6-0ca9-40c6-8f2d-f29a4b8d8a55

About this result

Related concepts (31)

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

Pulsed laser deposition

Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.

Related publications (32)

Effect of substrate crystalline morphology on the adhesion of plasma enhanced chemical vapor deposited thin silicon oxide coatings on polyamide

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